المؤلفون: Gharaibeh, Ali, Medgyes, Balint

المصدر: 2023 IEEE 29th International Symposium for Design and Technology in Electronic Packaging (SIITME) Design and Technology in Electronic Packaging (SIITME), 2023 IEEE 29th International Symposium for. :127-131 Oct, 2023

Relation: 2023 IEEE 29th International Symposium for Design and Technology in Electronic Packaging (SIITME)

المؤلفون: Gharaibeh, Ali, Medgyes, Balint

المصدر: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) Electronics System-Integration Technology Conference (ESTC), 2022 IEEE 9th. :484-487 Sep, 2022

Relation: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC)

المؤلفون: Zhengheng Lian, Youyang Chen, Chao Zhou, Minjie Li, Ziqiang Dong, Wencong Lu

المصدر: Journal of Materials Research and Technology, Vol 32, Iss , Pp 1256-1267 (2024)

مصطلحات موضوعية: Lead-free solder alloys, Machine learning, Creep resistance, Material design, Mining engineering. Metallurgy, TN1-997

وصف الملف: electronic resource

Relation: http://www.sciencedirect.com/science/article/pii/S2238785424017824; https://doaj.org/toc/2238-7854

URL الوصول: https://doaj.org/article/f3e4380ef7384262b70f0f48ae15a743

المؤلفون: Adam, Sandor, Medgyes, Balint, Rigler, Daniel, Szabo, Bence, Gal, Laszlo

المصدر: 2018 IEEE 24th International Symposium for Design and Technology in Electronic Packaging​ (SIITME) Design and Technology in Electronic Packaging​ (SIITME), 2018 IEEE 24th International Symposium for. :71-75 Oct, 2018

Relation: 2018 IEEE 24th International Symposium for Design and Technology in Electronic Packaging​ (SIITME)

المؤلفون: Liu, Zhuhao, Pan, Hongfa, Wang, Yibo, Xu, Ling, Lu, Jicun, Wu, Daike, Wu, Jian, Li, Ming, Gao, Liming

المصدر: 2018 19th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2018 19th International Conference on. :1400-1405 Aug, 2018

Relation: 2018 19th International Conference on Electronic Packaging Technology (ICEPT)

المؤلفون: Genanu, Mohammed, Mutuku, Francis, Cotts, Eric J, Wilcox, James, Arfaei, Babak, Perfecto, Eric

المصدر: 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2017 IEEE 67th. :423-428 May, 2017

Relation: 2017 IEEE 67th Electronic Components and Technology Conference (ECTC)

المؤلفون: Hillman, David, Wilcoxon, Ross^{Aff1, IDs1166402209886z_cor2}, Wieland, Amy

المصدر: Journal of Electronic Materials. 51(11):6492-6502

المؤلفون: Jaiswal, Dheeraj^{Aff1, IDs1166502206771y_cor1}, Pathote, Dileep, Singh, Vikrant, Behera, C. K.

المصدر: Journal of Materials Engineering and Performance. 31(9):7550-7560

المؤلفون: Genanu, Mohammed, Mutuku, Francis, Cotts, Eric J, Perfecto, Eric, Pollard, Scott, Shorey, Aric, Arfaei, Babak

المصدر: 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2016 IEEE 66th. :1141-1147 May, 2016

Relation: 2016 IEEE 66th Electronic Components and Technology Conference (ECTC)

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