يعرض 1 - 10 نتائج من 599 نتيجة بحث عن '"low temperature bonding"', وقت الاستعلام: 1.08s تنقيح النتائج
  1. 1
    مؤتمر
    Low-Temperature Nanocrystalline Cu/polymer Hybrid Bonding with Tailored CMP Process

    المؤلفون: Lee, Ou-Hsiang, Chiu, Wei-Lan, Chang, Hsiang-Hung, Chiang, Chia-Wen, Yu, Shih-Cheng, Yang, Tsung-Yu Ou, Hsiao, Su-Ching, Ko, Ting-Yu, Lin, Yu-Min, Wang, Chin-Hung, Lo, Wei-Chung, Lee, Chia-Hsin, Tan, Chung-An, Fowler, Michelle, Lubbers, Maycie

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1863-1867 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  2. 2
    مؤتمر
    Fine Pitch and Low Temperature Nanocrystalline-Nanotwinned Cu and SiCN-to-SiO2 Wafer-to-Wafer Hybrid Bonding

    المؤلفون: Chiu, Wei-Lan, Lee, Ou-Hsiang, Chang, Hsiang-Hung, Lo, James Yi-Jen, Shih, Chiang-Lin, Chiu, Hsih-Yang, Wang, Chin-Hung, Lo, Wei-Chung

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :319-324 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  3. 3
    مؤتمر
    Non-TCB Process Cu/SiO2 Hybrid Bonding Using Plasma-free Hydrophilicity Enhancement with NaOH for Chip-to-wafer Bonding

    المؤلفون: Chen, Yu-An, Ong, Jia-Juen, Chiu, Wei-Lan, Hsu, Wei-You, Yang, Shih-Chi, Chang, Hsiang-Hung, Chen, Chih

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :399-403 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  4. 4
    مؤتمر
    Low-Temperature Polymer Hybrid Bonding with Nanoparticulated Cu and Photosensitive Acrylic Adhesive

    المؤلفون: Sakamoto, Hirokatsu, Teranishi, Tadashi, Nagai, Rumi, Itaya, Ryo, Tamate, Hideaki, Fukushima, Takafumi, Happoya, Akihiko

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :871-875 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  5. 5
    دورية أكاديمية
    Low-Temperature Direct Bonding of Sputtered Nanocrystalline Ag Film for Power Electronic Packaging: Bonding Mechanism, Thermal Characteristics, and Reliability

    المؤلفون: Lu, D., Wang, X., Pan, H., Zheng, X., Li, M., Ji, H.

    المصدر: IEEE Transactions on Power Electronics IEEE Trans. Power Electron. Power Electronics, IEEE Transactions on. 39(5):6040-6051 May, 2024

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  6. 6
    مؤتمر
    Template Stripping Process Combined With Polyimide and SiO2/Si Templates for Obtaining Smooth Au Surfaces

    المؤلفون: Koseki, Shogo, Ogino, Mika, Takeuchi, Kai, Thu, Le Hac Huong, Matsumae, Takashi, Takagi, Hideki, Kurashima, Yuichi, Tsuda, Takahiro, Tokuhisa, Tomoaki, Shimizu, Toshikazu, Higurashi, Eiji

    المصدر: 2024 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2024 International Conference on. :129-130 Apr, 2024

    Relation: 2024 International Conference on Electronics Packaging (ICEP)

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  7. 7
    مؤتمر
    Surface Modification by Wet Treatment for Low-Temperature Cu/SiO2 Hybrid Bonding

    المؤلفون: Chen, Yu-An, Ong, Jia-Juen, Chiu, Wei-Lan, Chang, Hsiang-Hung, Chen, Chih

    المصدر: 2024 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2024 International Conference on. :115-116 Apr, 2024

    Relation: 2024 International Conference on Electronics Packaging (ICEP)

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  8. 8
    مؤتمر
    Solid-State Bonding with SAC305 Sheets for Direct Cooling

    المؤلفون: Jo, Eunjin, Kim, YehRi, Park, Young-Bae, Kim, Dongjin

    المصدر: 2024 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2024 International Conference on. :147-148 Apr, 2024

    Relation: 2024 International Conference on Electronics Packaging (ICEP)

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  9. 9
    مؤتمر
    Polymer Hybrid Bonding using Copper-Copper Bonding Materials and Thermosetting Resins for Copper-Copper Bonding at 200–250 °C

    المؤلفون: Sakamoto, Hirokatsu, Teranishi, Tadashi, Nagai, Rumi, Itaya, Ryo, Happoya, Akihiko

    المصدر: 2024 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2024 International Conference on. :73-74 Apr, 2024

    Relation: 2024 International Conference on Electronics Packaging (ICEP)

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  10. 10
    مؤتمر
    20 µm Copper Micro-Bump Bonding Through a Silver Metallization for Advanced Packaging Under a Low-Pressure Condition

    المؤلفون: Zhang, Zheng, Hsieh, Ming-Chun, Suetake, Aiji, Yoshida, Hiroshi, Okumuara, Rieko, Kagami, Noriko, Okamoto, Kazamasa, Chen, Chuantong, Hashizume, Kei, Hasegawa, Norihiko, Yoshida, Ryuji, Homma, Hidekazu, Suganuma, Katsuaki

    المصدر: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) Microelectronics and Packaging Conference & Exhibition (EMPC), 2023 24th European. :1-3 Sep, 2023

    Relation: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)

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