المؤلفون: Yang, Huohai, Tan, Haotian, Lu, Jianguo^{Aff2, Aff3, IDs1336902408984w_cor3}, Yang, Xinlian, Gao, Jiajia, Liu, Junni

المصدر: Arabian Journal for Science and Engineering. :1-18

المؤلفون: Dener, Murat, Altunhan, Ufuk, Benli, Ahmet^{Aff1, IDs4345202400991w_cor3}

المصدر: Archives of Civil and Mechanical Engineering. 24(3)

المؤلفون: Li, Changqing, Zhang, Guoping, Li, Jinhui, Li, Yingying

المصدر: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2021 22nd International Conference on. :1-4 Sep, 2021

Relation: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT)

المؤلفون: Ziwei Yuan, Meng Xie, Jianlei Qian, Wenjie Fan, Menglu Li, Liao Guo, Yan Sun, Wenxin Fu

المصدر: Aggregate, Vol 5, Iss 3, Pp n/a-n/a (2024)

مصطلحات موضوعية: aggregation‐induced emission, benzocyclobutene, low‐temperature curing, wafer bonding, Williamson reactions, Chemistry, QD1-999, Biology (General), QH301-705.5

وصف الملف: electronic resource

Relation: https://doaj.org/toc/2692-4560

URL الوصول: https://doaj.org/article/5149ab0573c84288b648c5032dcf0b63

المؤلفون: Sui, Yuying, Li, Jinhui, Wang, Tao, Shan, Liang, Liu, Qiang, Zhang, Guoping

المصدر: 2021 5th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) Electron Devices Technology & Manufacturing Conference (EDTM), 2021 5th IEEE. :1-3 Apr, 2021

Relation: 2021 5th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)

المؤلفون: Katarzyna Pojnar, Barbara Pilch-Pitera, Shahla Ataei, Patrycja Gazdowicz, Beata Mossety-Leszczak, Beata Grabowska, Artur Bobrowski

المصدر: Materials, Vol 17, Iss 14, p 3555 (2024)

مصطلحات موضوعية: low-temperature-curing powder coatings, reversible Diels–Alder reaction, self-healing, Technology, Electrical engineering. Electronics. Nuclear engineering, TK1-9971, Engineering (General). Civil engineering (General), TA1-2040, Microscopy, QH201-278.5, Descriptive and experimental mechanics, QC120-168.85

وصف الملف: electronic resource

Relation: https://www.mdpi.com/1996-1944/17/14/3555; https://doaj.org/toc/1996-1944

URL الوصول: https://doaj.org/article/e0847ff9024d4092a5e590b2f395ead6

المؤلفون: Huang, Chao, Li, Jinhui, Zhang, Guoping, Sun, Rong, Wong, Ching-ping

المصدر: 2019 20th International Conference on Electronic Packaging Technology(ICEPT) Electronic Packaging Technology(ICEPT), 2019 20th International Conference on. :1-4 Aug, 2019

Relation: 2019 20th International Conference on Electronic Packaging Technology(ICEPT)

المؤلفون: WU Mengdi, MA Haile, LIU Huimin

المصدر: Shipin yu jixie, Vol 39, Iss 9, Pp 177-182,233 (2023)

مصطلحات موضوعية: beef, ultrasonic, low temperature curing, refrigeration, Food processing and manufacture, TP368-456

وصف الملف: electronic resource

Relation: http://www.ifoodmm.com/spyjxen/article/abstract/20230928; https://doaj.org/toc/1003-5788

URL الوصول: https://doaj.org/article/062f1d52c4464b72b13f46fea87a61f1

المؤلفون: Nishimura, Masato, Matsukawa, Daisaku, Matsuie, Noritaka, Yamazaki, Noriyuki, Enomoto, Tetsuya, Ohe, Masayuki

المصدر: 2016 IEEE CPMT Symposium Japan (ICSJ) CPMT Symposium Japan (ICSJ), 2016 IEEE. :197-200 Nov, 2016

Relation: 2016 IEEE CPMT Symposium Japan (ICSJ)

المؤلفون: Siqi Quan, Guoyou Gan, Xiang lei Yu, Xian jie Tang, Hu Sun, Zhuo Qian, Junpeng Li

المصدر: Materials Research Express, Vol 11, Iss 5, p 055002 (2024)

مصطلحات موضوعية: conductive silver paste, low temperature curing, Ag NPs sintering, volume resistivity, Materials of engineering and construction. Mechanics of materials, TA401-492, Chemical technology, TP1-1185

وصف الملف: electronic resource

Relation: https://doaj.org/toc/2053-1591

URL الوصول: https://doaj.org/article/e093625c0f094cc0b76c5ddc9eac0b93