يعرض 1 - 10 نتائج من 2,573 نتيجة بحث عن '"low-dielectric"', وقت الاستعلام: 0.94s تنقيح النتائج
  1. 1
    مؤتمر
    Characterization of Warpage of Ultra-Low-K Dielectric Materials and Correlation with Modulus and Coefficient of Thermal Expansion

    المؤلفون: Kathaperumal, Mohanalingam, Bhaskar, Pragna, Toro, Austin J., Nimbalkar, Pratik, Dahal, Lila, Bakir, Muhannad S.

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1958-1962 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  2. 2
    مؤتمر
    Low Dielectric Materials for High Frequency Semiconductor Packaging Application

    المؤلفون: Hsu, Meei-Yu, Lin, Chih-Hao, Chen, Kai-Chi

    المصدر: 2024 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2024 International Conference on. :279-280 Apr, 2024

    Relation: 2024 International Conference on Electronics Packaging (ICEP)

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  3. 3
    مؤتمر
    Photosensitive Polyimides Compositions with Good Flexibility and Low Dielectric Property for Heterogeneous Chiplet Integration Technologies

    المؤلفون: Tasaki, Takashi, Yamaguchi, Takashi, Nakamura, Taiyou, Yamashita, Madoka

    المصدر: 2024 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2024 International Conference on. :7-8 Apr, 2024

    Relation: 2024 International Conference on Electronics Packaging (ICEP)

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  4. 4
    مؤتمر
    Properties of low dielectric constant buildup materials containing micron sized hollow silica

    المؤلفون: Preeya, Kuray, Tom, McCarthy, Caleb, Ancharski, Yoji, Nakajima

    المصدر: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :1260-1265 May, 2023

    Relation: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)

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  5. 5
    مؤتمر
    Novel Photosensitive Polyimides Compositions with Low Dielectric Property and Good Flexibility Corresponding to Redistribution Layers for High Speed Transmission Applications

    المؤلفون: Tazaki, Takashi, Yamaguchi, Takashi, Nakamura, Taiyou, Yamashita, Madoka

    المصدر: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :64-71 May, 2023

    Relation: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)

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  6. 6
    دورية أكاديمية
    Unlocking the Potential of Resveratrol-Derived Trifunctional Photosensitive Benzoxazines for Superhydrophobic, Low Dielectric and Photoluminescence Applications

    المؤلفون: Appasamy, Subasri, Krishnasamy, BalajiAff1, IDs1092402403248y_cor2, Arumugam, HariharanAff1, IDs1092402403248y_cor3, Muthukaruppan, AlagarAff1, IDs1092402403248y_cor4

    المصدر: Journal of Polymers and the Environment: formerly: `Journal of Environmental Polymer Degradation'. :1-15

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  7. 7
    مؤتمر
    Grafting low-k organic films onto copper surface by one-step electrografting method via aryldiazonium chemistry

    المؤلفون: Cao, Liang, Xue, Qi, Zheng, Yi, Tian, Yuan, Hang, Tao, Wu, Yunwen, Li, Ming

    المصدر: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2022 23rd International Conference on. :1-4 Aug, 2022

    Relation: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT)

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  8. 8
    مؤتمر
    Thermomechanical and Electrical Properties of the $\text{SiO}_{2}/\text{ZrW}_{2}\mathrm{O}_{8}/\text{Epoxy}$ Composite

    المؤلفون: Li, Chaofan, Luo, Suibin, Yu, Shuhui, Chu, Baojin, Sun, Rong

    المصدر: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2021 22nd International Conference on. :1-5 Sep, 2021

    Relation: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT)

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  9. 9
    كتاب إلكتروني
    Low-k Dielectric for Semiconductor Packaging: Advancements, Challenges, and Future Outlook

    المؤلفون: Kossar, ShahnazAff6

    المساهمون: Song, Young Suh, editorAff1, Thoutam, Laxman Raju, editorAff2, Tayal, Shubam, editorAff3, Rahi, Shiromani Balmukund, editorAff4, Samuel, T. S. Arun, editorAff5

    المصدر: Handbook of Emerging Materials for Semiconductor Industry. :743-753

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  10. 10
    مؤتمر
    Chemicals Informatics: Explore Structural Factors and Potential Chemicals based on Public Literatures

    المؤلفون: Isobe, Takashi, Okada, Yoshihiro

    المصدر: 2021 IEEE International Conference on Big Data (Big Data) Big Data (Big Data), 2021 IEEE International Conference on. :1837-1846 Dec, 2021

    Relation: 2021 IEEE International Conference on Big Data (Big Data)

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