المؤلفون: Tanaka, Kentaro, Nishimura, Masanari, Kida, Noriyuki, Watanabe, Takaaki

المصدر: 2024 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2024 International Conference on. :1-2 Apr, 2024

Relation: 2024 International Conference on Electronics Packaging (ICEP)

المؤلفون: Kang, Seung-Mo, Um, Byung Jo, Jang, Junho, Lee, Hyunhwan, Bae, Byeong-Soo

المصدر: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :2144-2149 May, 2023

Relation: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)

المؤلفون: Luo, Ping, Wang, Hao

المصدر: 2022 IEEE 16th International Conference on Solid-State & Integrated Circuit Technology (ICSICT) Solid-State & Integrated Circuit Technology (ICSICT), 2022 IEEE 16th International Conference on. :1-3 Oct, 2022

Relation: 2022 IEEE 16th International Conference on Solid-State & Integrated Circuit Technology (ICSICT)

المؤلفون: Chu, Shaoshuai^Aff14, Kurganov, Alexander^Aff15, Xin, Ruixiao^Aff14

المساهمون: Castro, Carlos, Editor-in-Chief^Aff1, Formaggia, Luca, Editor-in-Chief^Aff2, Groppi, Maria, Series Editor^Aff3, Larson, Mats G., Series Editor^Aff4, Lopez Fernandez, Maria, Series Editor^Aff5, Morales de Luna, Tomás, Series Editor^{Aff6, Aff12}, Pareschi, Lorenzo, Series Editor^Aff7, Vázquez-Cendón, Elena, Series Editor^Aff8, Zunino, Paolo, Series Editor^Aff9, Parés, Carlos, editor^Aff10, Castro, Manuel J., editor^Aff11, Muñoz-Ruiz, María Luz, editor^Aff13

المصدر: Hyperbolic Problems: Theory, Numerics, Applications. Volume II : HYP2022, Málaga, Spain, June 20-24, 2022. 35:51-61

المؤلفون: Isobe, Takashi, Okada, Yoshihiro

المصدر: 2021 IEEE International Conference on Big Data (Big Data) Big Data (Big Data), 2021 IEEE International Conference on. :1837-1846 Dec, 2021

Relation: 2021 IEEE International Conference on Big Data (Big Data)

المؤلفون: Weiping Wei, Youlin Shang, Hongwei Jiao, Pujun Jia

المصدر: AIMS Mathematics, Vol 9, Iss 3, Pp 7511-7528 (2024)

مصطلحات موضوعية: low dissipation, flux splitting scheme, shock stability, upwind method, Mathematics, QA1-939

وصف الملف: electronic resource

Relation: https://doaj.org/toc/2473-6988

URL الوصول: https://doaj.org/article/ea7eb8f1e0ec4acba35caf0e14ac25fc

المؤلفون: Kurganov, Alexander^{Aff1, IDs10915023022818_cor1}, Xin, Ruixiao

المصدر: Journal of Scientific Computing. 96(2)

المؤلفون: Alinejad, H., Shahmansouri, M.

المصدر: IEEE Transactions on Plasma Science IEEE Trans. Plasma Sci. Plasma Science, IEEE Transactions on. 47(9):4378-4384 Sep, 2019

المؤلفون: Watanabe, Takaaki, Kida, Noriyuki, Takahashi, Makoto, Hirai, Takayoshi

المصدر: 2021 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2021 International Conference on. :81-82 May, 2021

Relation: 2021 International Conference on Electronics Packaging (ICEP)

المؤلفون: Ji, Zhe^{Aff1, Aff2}, Liang, Tian, Fu, Lin^{Aff3, Aff4, Aff5, IDs10915023021991_cor3}

المصدر: Journal of Scientific Computing. 95(3)