يعرض 1 - 10 نتائج من 271 نتيجة بحث عن '"lumped element model"', وقت الاستعلام: 1.22s تنقيح النتائج
  1. 1
    دورية أكاديمية
    Field-Circuit Coupled Simulation With an Equivalent Circuit Model for High-Voltage Spark Gaps

    المؤلفون: Lee, K., Hong, S.

    المصدر: IEEE Transactions on Plasma Science IEEE Trans. Plasma Sci. Plasma Science, IEEE Transactions on. 52(1):111-119 Jan, 2024

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  2. 2
    دورية أكاديمية
    New Insights for Parasitic Effects of Label-Free Biosensors Based on Capacitive Micromachined Ultrasonic Transducers

    المؤلفون: Zhao, Y., Li, Z., Wang, X., Luo, G., Li, J., Yuan, J., Zhao, L., Yang, P., Jiang, Z., Carrara, S.

    المصدر: IEEE Sensors Journal IEEE Sensors J. Sensors Journal, IEEE. 22(21):20575-20584 Nov, 2022

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  3. 3
    مؤتمر
    Extraction of π -Capacitor Equivalent Circuit Elements for Field-Effect Transistors in Deep Pinch-Off

    المؤلفون: Kostelac, Fran, Babic, Dubravko

    المصدر: 2021 44th International Convention on Information, Communication and Electronic Technology (MIPRO) Information, Communication and Electronic Technology (MIPRO), 2021 44th International Convention on. :5-11 Sep, 2021

    Relation: 2021 44th International Convention on Information, Communication and Electronic Technology (MIPRO)

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  4. 4
    دورية أكاديمية
    An Improved Lumped Element Model for Circular-Shape pMUTs

    المؤلفون: Pala, S., Lin, L.

    المصدر: IEEE Open Journal of Ultrasonics, Ferroelectrics, and Frequency Control IEEE Open J. Ultrason., Ferroelect., Freq. Contr. Ultrasonics, Ferroelectrics, and Frequency Control, IEEE Open Journal of. 2:83-95 2022

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  5. 5
    مؤتمر
    A Tunable Macro-Modeling Method for Signal Transition in mm-Wave Flip-Chip Technology

    المؤلفون: Namaki, Pouya, Masoumi, Nasser, Nezhad-Ahmadi, Mohammad-Reza, Safavi-Naeini, Safieddin

    المصدر: 2021 IEEE 25th Workshop on Signal and Power Integrity (SPI) Signal and Power Integrity (SPI), 2021 IEEE 25th Workshop on. :1-4 May, 2021

    Relation: 2021 IEEE 25th Workshop on Signal and Power Integrity (SPI)

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  6. 6
    دورية أكاديمية
    Lumped Element Model of Spherical Cells Exposed to an External Electric Field

    المؤلفون: Harke, S., Manteuffel, D.

    المصدر: IEEE Journal of Electromagnetics, RF and Microwaves in Medicine and Biology IEEE J. Electromagn. RF Microw. Med. Biol. Electromagnetics, RF and Microwaves in Medicine and Biology, IEEE Journal of. 5(4):355-361 Dec, 2021

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  7. 7
    دورية أكاديمية
    Electrical Characterization of the Tongue and the Soft Palate Using Lumped-Element Model for Intraoral Neuromodulation

    المؤلفون: Park, B., Biswas, S., Park, H.

    المصدر: IEEE Transactions on Biomedical Engineering IEEE Trans. Biomed. Eng. Biomedical Engineering, IEEE Transactions on. 68(10):3151-3160 Oct, 2021

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  8. 8
    دورية أكاديمية
    A Fast Technique for Realization of Lumped-Element Values Into 3-D Physical Layout on LTCC

    المؤلفون: Pourzadi, A., Adibi, A., Mousavi, S.H., Kouki, A.

    المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 11(9):1497-1505 Sep, 2021

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  9. 9
    مؤتمر
    Automatic Conversion of a 3D Thermal Model of a Battery Cell into a 1D Lumped-Element Network : Paper for special session 8 - Multi-level Models for Simulation of Electrified Vehicles

    المؤلفون: Salvador-Iborra, Josep, Schneider, Juergen, Tatschl, Reinhard

    المصدر: 2020 IEEE Vehicle Power and Propulsion Conference (VPPC) Vehicle Power and Propulsion Conference (VPPC), 2020 IEEE. :1-6 Nov, 2020

    Relation: 2020 IEEE Vehicle Power and Propulsion Conference (VPPC)

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  10. 10
    مؤتمر
    Combined Series and Shunt Characterization for Accurate Resonant Frequency Extraction and Circuit Modelling of Surface-Mount Inductors

    المؤلفون: Bacmaga, Josip, Stimac, Hrvoje, Baric, Adrijan

    المصدر: 2020 IEEE 24th Workshop on Signal and Power Integrity (SPI) Signal and Power Integrity (SPI), 2020 IEEE 24th Workshop on. :1-4 May, 2020

    Relation: 2020 IEEE 24th Workshop on Signal and Power Integrity (SPI)

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