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1مؤتمر
المؤلفون: Boaks, Mawla, Roper, Connor, Woolley, Adam T., Christensen, Kenneth A., Nordin, Gregory P.
المصدر: 2023 IEEE BioSensors Conference (BioSensors) BioSensors Conference (BioSensors), 2023 IEEE. :1-4 Jul, 2023
Relation: 2023 IEEE BioSensors Conference (BioSensors)
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2مؤتمر
المؤلفون: Enderlein, Tom, Morschhauser, Andreas, Nestler, Jorg, Jobst, Gerhard, Stohr, Uwe, Selbmann, Franz, Otto, Thomas
المصدر: 2023 Smart Systems Integration Conference and Exhibition (SSI) Smart Systems Integration Conference and Exhibition (SSI), 2023. :1-6 Mar, 2023
Relation: 2023 Smart Systems Integration Conference and Exhibition (SSI)
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3مؤتمر
المؤلفون: Matthews, Liam, Disharoon, Dante, Pourang, Sina, Gupta, Anirban Sen, Suster, Michael, Mohseni, Pedram
المصدر: 2022 IEEE Sensors Sensors, 2022 IEEE. :1-4 Oct, 2022
Relation: 2022 IEEE Sensors
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4دورية أكاديمية
المؤلفون: Yiqiang Fan, Ziyu Li
المصدر: Frontiers in Lab on a Chip Technologies, Vol 3 (2024)
مصطلحات موضوعية: lab on a chip (LoC), microfluidics, droplet micro fluidics, bio film, artifical intelligence (AI), Technology (General), T1-995
وصف الملف: electronic resource
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5كتاب إلكتروني
المؤلفون: Matuttis, Hans-GeorgAff8, Schneider, Johannes JosefAff9, Aff10, Li, JinAff10, Barrow, David AnthonyAff10, Faggian, AlessiaAff11, Diaz, Aitor PatiñoAff11, Holler, SilviaAff11, Casiraghi, FedericaAff11, Sanahuja, Lorena CebollaAff11, Hanczyc, Martin MichaelAff11, Aff12, Weyland, Mathias SebastianAff9, Flumini, DandoloAff9, Hotz, Peter EggenbergerAff9, Dimitriou, PantelitsaAff10, Jamieson, William DavidAff13, Castell, OliverAff13, Füchslin, Rudolf MarcelAff9, Aff14
المساهمون: Filipe, Joaquim, Editorial Board MemberAff1, Ghosh, Ashish, Editorial Board MemberAff2, Prates, Raquel Oliveira, Editorial Board MemberAff3, Zhou, Lizhu, Editorial Board MemberAff4, De Stefano, Claudio, editorAff5, Fontanella, Francesco, editorAff6, Vanneschi, Leonardo, editorAff7
المصدر: Artificial Life and Evolutionary Computation : 16th Italian Workshop, WIVACE 2022, Gaeta, Italy, September 14–16, 2022, Revised Selected Papers. 1780:82-93
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6كتاب إلكتروني
المؤلفون: Giri Nandagopal, M. S.Aff12, Krishnamurthy, SriramAff13, Venkatesh, ThulasiramanAff14, Aff15
المساهمون: Barbosa-Cánovas, Gustavo V., Series EditorAff1, Aguilera, José Miguel, Advisory EditorAff2, Candoğan, Kezban, Advisory EditorAff3, Hartel, Richard W., Advisory EditorAff4, Ibarz, Albert, Advisory EditorAff5, Peleg, Micha, Advisory EditorAff6, Rahman, Shafiur, Advisory EditorAff7, Rao, M. Anandha, Advisory EditorAff8, Roos, Yrjö, Advisory EditorAff9, Welti-Chanes, Jorge, Advisory EditorAff10, Režek Jambrak, Anet, editorAff11
المصدر: Nonthermal Processing in Agri-Food-Bio Sciences : Sustainability and Future Goals. :655-668
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7مؤتمر
المؤلفون: Loth, Andreas, Forster, Ralf
المصدر: 2016 IEEE 11th Annual International Conference on Nano/Micro Engineered and Molecular Systems (NEMS) Nano/Micro Engineered and Molecular Systems (NEMS), 2016 IEEE 11th Annual International Conference on. :29-33 Apr, 2016
Relation: 2016 IEEE 11th Annual International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)
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8مؤتمر
المؤلفون: Taylor, Elysia, Bonner, James, Nelson, Russell, Fuller, Christopher, Kirkey, William, Cappelli, Stephanie
المصدر: OCEANS 2015 - MTS/IEEE Washington OCEANS'15 MTS/IEEE Washington. :1-4 Oct, 2015
Relation: OCEANS 2015 - MTS/IEEE Washington
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9مؤتمر
المؤلفون: Zhao, Wei, Yang, Tianxiang, Olguin, Carlos
المصدر: 2015 14th International Conference on Computer-Aided Design and Computer Graphics (CAD/Graphics) Computer-Aided Design and Computer Graphics (CAD/Graphics), 2015 14th International Conference on. :113-120 Aug, 2015
Relation: 2015 14th International Conference on Computer-Aided Design and Computer Graphics (CAD/Graphics)
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10مؤتمر
المؤلفون: Romagnoli, G., Buytaert, J., Dumps, R., Francescon, A., De Aguiar Francisco, O. A., Howell, K., Mapelli, A., Nuessle, G., Petagna, P.
المصدر: Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2014 IEEE Intersociety Conference on. :658-665 May, 2014
Relation: 2014 IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)