المؤلفون: Bargiel, Sylwester, Zamkotsian, Frederic, Gauthier-Manuel, Ludovic, Balharet, Djaffar, Salut, Roland

المصدر: 2024 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2024 Symposium on. :1-5 Jun, 2024

Relation: 2024 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)

المؤلفون: Li, X., Xia, B., Wang, H., Su, P.

المصدر: IEEE Photonics Journal IEEE Photonics J. Photonics Journal, IEEE. 16(1):1-6 Feb, 2024

المؤلفون: Li, Hu, Zhang, Zhiguo, Guo, Shushan, Cai, Shanyong, Yan, Zhehao, Li, Yuemei

المصدر: 2023 China Automation Congress (CAC) Automation Congress (CAC), 2023 China. :9442-9445 Nov, 2023

Relation: 2023 China Automation Congress (CAC)

المؤلفون: Mistry, Akash, Nieweglowski, Krzysztof, Bock, Karlheinz

المصدر: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) Microelectronics and Packaging Conference & Exhibition (EMPC), 2023 24th European. :1-5 Sep, 2023

Relation: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)

المؤلفون: Wang, Shuying, Li, Bo, Qian, Yujie, Wang, Huimin, Tang, Shuo, Lu, Jixi

المصدر: 2023 IEEE 16th International Conference on Electronic Measurement & Instruments (ICEMI) Electronic Measurement & Instruments (ICEMI), 2023 IEEE 16th International Conference on. :133-137 Aug, 2023

Relation: 2023 IEEE 16th International Conference on Electronic Measurement & Instruments (ICEMI)

المؤلفون: Zheng, Bangsheng, Dong, Ruili, Tan, Yonghong, Li, Xiaoli

المصدر: 2023 42nd Chinese Control Conference (CCC) Chinese Control Conference (CCC), 2023 42nd. :6678-6681 Jul, 2023

Relation: 2023 42nd Chinese Control Conference (CCC)

المؤلفون: Lin, Hung-Yu, Cheng, Hao-Chien, Liu, Shih-Chi, Hsu, Chih-Chen, Chen, Si-Han, Hsieh, Jerwei, Huang, Ruey-Shing, Lai, Mei-Feng, Fang, Weileun

المصدر: 2023 22nd International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers) Solid-State Sensors, Actuators and Microsystems (Transducers), 2023 22nd International Conference on. :1417-1420 Jun, 2023

Relation: 2023 22nd International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers)

المؤلفون: Xia, Yuhu, Ling, Biyun, Wang, Xiaoyue, Cai, Minli, Wu, Yaming

المصدر: 2023 22nd International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers) Solid-State Sensors, Actuators and Microsystems (Transducers), 2023 22nd International Conference on. :445-448 Jun, 2023

Relation: 2023 22nd International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers)

المؤلفون: Lin, Hung-Yu, Cheng, Hao-Chien, Liu, Shih-Chi, Hsu, Chih-Chen, Chen, Si-Han, Wu, Mingching, Liang, Kai-Chih, Lai, Mei-Feng, Fang, Weileun

المصدر: 2023 22nd International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers) Solid-State Sensors, Actuators and Microsystems (Transducers), 2023 22nd International Conference on. :1480-1483 Jun, 2023

Relation: 2023 22nd International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers)

المؤلفون: Portelli, Barnaby, Grech, Ivan, Micallef, Joseph, Farrugia, Russell, Casha, Owen, Gatt, Edward

المصدر: 2023 Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (DTIP) Design, Test, Integration & Packaging of MEMS/MOEMS (DTIP), 2023 Symposium on. :1-4 May, 2023

Relation: 2023 Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (DTIP)