المؤلفون: Miao Yang, Yang Kai, Zhao Peng, Yang Zhihua, Yu Xueyong, Duan Xiaoming, Zhou Yu

المصدر: 中国工程科学, Vol 26, Iss 3, Pp 34-41 (2024)

مصطلحات موضوعية: dielectric, microwave dielectric ceramics, microwave components, new materials, Engineering (General). Civil engineering (General), TA1-2040

وصف الملف: electronic resource

Relation: http://www.engineering.org.cn/en/10.15302/J-SSCAE-2024.03.006; https://doaj.org/toc/2096-0034

URL الوصول: https://doaj.org/article/fa961e17a4b144838279010a57ecc07f

المؤلفون: Deng, Haiqing, Qu, Xin, He, Yinghan, Wei, Xiaoli, Wu, You, Chen, Xiuli^{Aff1, IDs10832023003297_cor6}, Zhou, Huanfu^{Aff1, IDs10832023003297_cor7}

المصدر: Journal of Electroceramics. 51(2):59-70

المؤلفون: Guoqiang He, Yu Jiang, Kaixin Song, Yanjun Liu, Yuan Nie, Wenjie Zhang, Ziqi Zhao, Yinghan He, Xinyue Ma, Xiuli Chen, Xu Li, Huanfu Zhou

المصدر: Journal of Advanced Ceramics, Vol 13, Iss 2, Pp 155-165 (2024)

مصطلحات موضوعية: millimeter wave, microwave dielectric ceramics, dielectric resonator antenna, nonstoichiometric ratio, Clay industries. Ceramics. Glass, TP785-869

وصف الملف: electronic resource

Relation: https://www.sciopen.com/article/10.26599/JAC.2024.9220828; https://doaj.org/toc/2226-4108; https://doaj.org/toc/2227-8508

URL الوصول: https://doaj.org/article/41717b25a195493a8dd377d4ffc8588f

المؤلفون: Wu, Chenghao, Hu, Yongda, Chen, Jie

المصدر: 2020 21st International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2020 21st International Conference on. :1-3 Aug, 2020

Relation: 2020 21st International Conference on Electronic Packaging Technology (ICEPT)

المؤلفون: Yin, Jun, Yang, Xi-zhi, Lai, Yuan-ming^{Aff1, IDs1177102353219_cor3}, Zhang, Qin, Qi, Cong, Li, Xiao, Su, Hua, Wu, Chong-sheng, Jiang, Gang

المصدر: Journal of Central South University: Science & Technology of Mining and Metallurgy. 30(5):1461-1468

المؤلفون: Yang, Leiyu, Zhang, Shuren, Sun, Chengli, Dong, Xue

المصدر: 2018 19th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2018 19th International Conference on. :400-403 Aug, 2018

Relation: 2018 19th International Conference on Electronic Packaging Technology (ICEPT)

المؤلفون: Jian BAO, Yuping ZHANG, Hideo KIMURA, Haitao WU, Zhenxing YUE

المصدر: Journal of Advanced Ceramics, Vol 12, Iss 1, Pp 82-92 (2023)

مصطلحات موضوعية: microwave dielectric ceramics (mwdcs), nd2(zr1−xtix)3(moo4)9 (nz1−xtxm), phillips–van vechten–levine (p–v–l) theory, theoretical dielectric loss, Clay industries. Ceramics. Glass, TP785-869

وصف الملف: electronic resource

Relation: https://www.sciopen.com/article/10.26599/JAC.2023.9220668; https://doaj.org/toc/2226-4108; https://doaj.org/toc/2227-8508

URL الوصول: https://doaj.org/article/c1ccedd30ab148d2a394d4e851e107ae

المؤلفون: Hasanain Altalebi, Alaa Atiyah, Saad Farid

المصدر: Engineering and Technology Journal, Vol 40, Iss 12, Pp 1795-1802 (2022)

مصطلحات موضوعية: 5g antenna, inorganic nanoparticles, microwave dielectric ceramics, epoxy, microwave dielectric properties, Science, Technology

وصف الملف: electronic resource

Relation: https://etj.uotechnology.edu.iq/article_176523_50bb19d446f5e8582864bf7e283a6d98.pdf; https://doaj.org/toc/1681-6900; https://doaj.org/toc/2412-0758

URL الوصول: https://doaj.org/article/1b502297b28146539e15e7ff1b3ec36a

المؤلفون: Gao, Yufeng, Jiang, Juan, Wang, Jinzhao, Gan, Lin^{Aff1, IDs4320702200223y_cor4}, Zhang, Tianjin^{Aff1, IDs4320702200223y_cor5}

المصدر: Journal of the Korean Ceramic Society: 한국세라믹학회지. 59(6):929-935

المؤلفون: He, Guoqiang, Wang, Haiquan, Li, Qing, Wu, You, Chen, Xiuli, Liang, Jun^{Aff1, IDs11664022096307_cor6}, Zhou, Huanfu^{Aff1, IDs11664022096307_cor7}

المصدر: Journal of Electronic Materials. 51(9):5026-5031