المؤلفون: Yang, Y., Mei, J., Wu, A., Ma, G.

المصدر: IEEE Transactions on Systems, Man, and Cybernetics: Systems IEEE Trans. Syst. Man Cybern, Syst. Systems, Man, and Cybernetics: Systems, IEEE Transactions on. 54(7):4294-4304 Jul, 2024

المؤلفون: Li, X., Wang, X., Xing, Z.

المصدر: IEEE Transactions on Industrial Electronics IEEE Trans. Ind. Electron. Industrial Electronics, IEEE Transactions on. 71(6):5618-5629 Jun, 2024

المؤلفون: Shende, Vaishali Gajendra, Raviraja, S., P, Kavitha, Aancy, H. Mickle, Kumar, M Jogendra, Mittal, Varsha

المصدر: 2024 Ninth International Conference on Science Technology Engineering and Mathematics (ICONSTEM) Science Technology Engineering and Mathematics (ICONSTEM), 2024 Ninth International Conference on. :1-4 Apr, 2024

Relation: 2024 Ninth International Conference on Science Technology Engineering and Mathematics (ICONSTEM)

المؤلفون: Xie, Z., Jin, L., Luo, X., Zhou, M., Zheng, Y.

المصدر: IEEE/ASME Transactions on Mechatronics IEEE/ASME Trans. Mechatron. Mechatronics, IEEE/ASME Transactions on. 29(2):1534-1545 Apr, 2024

المؤلفون: Sha, Akhbar, Adwaith Krishna, E R, Inture, Anvita Reddy, Menon, Devika S, Joseph, Jose, T, Anjali

المصدر: 2023 2nd International Conference on Automation, Computing and Renewable Systems (ICACRS) Automation, Computing and Renewable Systems (ICACRS), 2023 2nd International Conference on. :792-797 Dec, 2023

Relation: 2023 2nd International Conference on Automation, Computing and Renewable Systems (ICACRS)

المؤلفون: Geng, Haixiao, Fan, Jingfan, Yuan, Yujia, Ai, Danni, Duan, Feng, Yang, Jian

المصدر: 2023 IEEE International Conference on Bioinformatics and Biomedicine (BIBM) Bioinformatics and Biomedicine (BIBM), 2023 IEEE International Conference on. :1925-1928 Dec, 2023

Relation: 2023 IEEE International Conference on Bioinformatics and Biomedicine (BIBM)

المؤلفون: Kumar, Ajay, Dhiman, Rohit

المصدر: 2023 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Advanced Packaging and Systems (EDAPS), 2023 IEEE Electrical Design of. :1-3 Dec, 2023

Relation: 2023 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)

المؤلفون: Ji, K., Shen, Y., Wang, F., Chen, Q., Zhang, L.

المصدر: IEEE Transactions on Geoscience and Remote Sensing IEEE Trans. Geosci. Remote Sensing Geoscience and Remote Sensing, IEEE Transactions on. 62:1-13 2024

المؤلفون: Shani, J., Tirer, T., Giryes, R., Bendory, T.

المصدر: IEEE Open Journal of Signal Processing IEEE Open J. Signal Process. Signal Processing, IEEE Open Journal of. 5:621-629 2024

المؤلفون: Wu, Yue, Li, Zhixin, Zhang, Jinyuan, Yang, Yishuang, Wang, Haiman, Xia, Yi, Chen, Lin, Jiang, Yi, Zhao, Xudong, Zhang, Zihao

المصدر: 2023 International Conference on Image Processing, Computer Vision and Machine Learning (ICICML) Image Processing, Computer Vision and Machine Learning (ICICML), 2023 International Conference on. :191-196 Nov, 2023

Relation: 2023 International Conference on Image Processing, Computer Vision and Machine Learning (ICICML)