المؤلفون: Zhou, Jinxin^Aff13, Kitazawa, Daisuke^Aff13, Hayakawa, Yuki^Aff14, Yoshida, Ikuo^Aff14, Tabata, Kotaro^Aff15, Okumura, Kuniaki^Aff15

المساهمون: di Prisco, Marco, Series Editor^Aff1, Chen, Sheng-Hong, Series Editor^Aff2, Vayas, Ioannis, Series Editor^Aff3, Kumar Shukla, Sanjay, Series Editor^Aff4, Sharma, Anuj, Series Editor^Aff5, Kumar, Nagesh, Series Editor^Aff6, Wang, Chien Ming, Series Editor^{Aff7, Aff12}, Cui, Zhen-Dong, Series Editor^Aff8, Ikoma, Tomoki, editor^Aff9, Tabeta, Shigeru, editor^Aff10, Lim, Soon Heng, editor^Aff11

المصدر: Proceedings of the Third World Conference on Floating Solutions : WCFS 2023; 28–29 August, Tokyo, Japan. 465:475-494

المؤلفون: Yu, Le, Nine, Md J., Tung, Tran T., Pereira, Ana L. C.^{Aff1, Aff2}, Hassan, Kamrul, Tran, Diana, Santos, Alexandre^{Aff3, Aff4, Aff5}, Losic, Dusan^{Aff1, IDs41127023000644_cor8}

المصدر: Graphene and 2D Materials. 8(3-4):151-159

المؤلفون: Ulviye Bunyatova, Mustafa Dogan, Engincan Tekin, Onur Ferhanoğlu

المصدر: Scientific Reports, Vol 14, Iss 1, Pp 1-11 (2024)

مصطلحات موضوعية: Ultra-stable sub-millimeter bubbles AgNPs colloidal, Photosensitive bio-nanocomposite, Bubble modeling, Multi-layered structure, Low laser excitation, Medicine, Science

وصف الملف: electronic resource

Relation: https://doaj.org/toc/2045-2322

URL الوصول: https://doaj.org/article/28b76eac925d4d838b806fb8dad015ab

المؤلفون: Ding, J., Liu, Z., Zhang, Y., Gong, S., Yu, G.

المصدر: IEEE Access Access, IEEE. 10:69851-69865 2022

المؤلفون: Xu, Ke, Xu, Xiaoming^{Aff1, Aff2}, Yang, Qi, Wu, Jianing^{Aff1, Aff4}, Wu, Zhigang^{Aff1, IDs42235023003844_cor5}, Yang, Jinzhao^{Aff1, IDs42235023003844_cor6}

المصدر: Journal of Bionic Engineering. 20(5):1930-1941

المؤلفون: Nidhin, K, Balanethiram, Suresh, Nair, Deleep R., Chakravorty, Anjan

المصدر: 2020 4th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) Electron Devices Technology & Manufacturing Conference (EDTM), 2020 4th IEEE. :1-4 Apr, 2020

Relation: 2020 4th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)

المؤلفون: Bandoh, Yukihiro, Takamura, Seishi, Shimizu, Atsushi

المصدر: 2019 IEEE International Conference on Image Processing (ICIP) Image Processing (ICIP), 2019 IEEE International Conference onhttps://idams.ieee.org/idams/custom/properties/properties.jsp#. :4075-4079 Sep, 2019

Relation: 2019 IEEE International Conference on Image Processing (ICIP)

المؤلفون: Kumar, Munish, Nath, Vandana

المصدر: 2017 IEEE Asia Pacific Microwave Conference (APMC) Microwave Conference (APMC), 2017 IEEE Asia Pacific. :964-967 Nov, 2017

Relation: 2017 IEEE Asia Pacific Microwave Conference (APMC)

المؤلفون: Bunyatova, Ulviye^{Aff1, IDs4159802455654w_cor1}, Dogan, Mustafa, Tekin, Engincan, Ferhanoğlu, Onur

المصدر: Scientific Reports. 14(1)

المؤلفون: Huang, Shaode, Pan, Jin, Yang, Deqiang, Wang, Chao-Fu

المصدر: 2020 IEEE International Conference on Computational Electromagnetics (ICCEM) Computational Electromagnetics (ICCEM), 2020 IEEE International Conference on. :60-61 Aug, 2020

Relation: 2020 IEEE International Conference on Computational Electromagnetics (ICCEM)