المؤلفون: Chen, Ming-Qiang, Zhou, Min-Bo, Li, Yun-Wei, Zhang, Xin-Ping

المصدر: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2021 22nd International Conference on. :1-5 Sep, 2021

Relation: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT)

المؤلفون: M.S. Chang, M.A.A. Mohd Salleh, D.S.C. Halin, F. Somidin, H. Yasuda, K. Nogita

المصدر: Journal of Materials Research and Technology, Vol 26, Iss , Pp 8670-8687 (2023)

مصطلحات موضوعية: Microalloying, Intermetallic, Multiple reflow, Synchrotron radiography, Mining engineering. Metallurgy, TN1-997

وصف الملف: electronic resource

Relation: http://www.sciencedirect.com/science/article/pii/S2238785423022652; https://doaj.org/toc/2238-7854

URL الوصول: https://doaj.org/article/8fd26764e5654ccd87e79591ce676fff

المؤلفون: Li, Bin, Zhao, Zhenqing, Li, Mingyu, Wang, Tao, Li, Hui

المصدر: 2017 18th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2017 18th International Conference on. :557-560 Aug, 2017

Relation: 2017 18th International Conference on Electronic Packaging Technology (ICEPT)

المؤلفون: Ma, H.R., Wang, Y.P, Chen, J., Ma, H.T., Zhao, N.

المصدر: 2017 18th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2017 18th International Conference on. :1402-1405 Aug, 2017

Relation: 2017 18th International Conference on Electronic Packaging Technology (ICEPT)

المؤلفون: Zhou, Min-Bo, Jin, Hong, Ke, Chang-Bo, Zhang, Xin-Ping

المصدر: 2015 16th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2015 16th International Conference on. :333-337 Aug, 2015

Relation: 2015 16th International Conference on Electronic Packaging Technology (ICEPT)

المؤلفون: Branzei, Mihai, Plotog, Ioan, Miculescu, Florin, Varzaru, Gaudentiu, Svasta, Paul, Thumm, Andreas

المصدر: 2012 35th International Spring Seminar on Electronics Technology Electronics Technology (ISSE), 2012 35th International Spring Seminar on. :155-160 May, 2012

Relation: 2012 35th International Spring Seminar on Electronics Technology (ISSE)

المؤلفون: Siti Farahnabilah Muhd Amli, Mohd Arif Anuar Mohd Salleh, Mohd Sharizal Abdul Aziz, Hideyuki Yasuda, Kazuhiro Nogita, Mohd Mustafa Al Bakri Abdullah, Ovidiu Nemes, Andrei Victor Sandu, Petrica Vizureanu

المصدر: Materials, Vol 16, Iss 12, p 4360 (2023)

مصطلحات موضوعية: soldering, primary intermetallics, synchrotron, multiple reflow, finite element, Technology, Electrical engineering. Electronics. Nuclear engineering, TK1-9971, Engineering (General). Civil engineering (General), TA1-2040, Microscopy, QH201-278.5, Descriptive and experimental mechanics, QC120-168.85

وصف الملف: electronic resource

Relation: https://www.mdpi.com/1996-1944/16/12/4360; https://doaj.org/toc/1996-1944

URL الوصول: https://doaj.org/article/d7ab14ebe62949ec9285e6933a9c2055

المؤلفون: Tikale, Sanjay^Aff1, Narayan Prabhu, K.^Aff1

المصدر: Transactions of the Indian Institute of Metals. 71(11):2855-2859

المؤلفون: Tikale, Sanjay^Aff1, Prabhu, K. Narayan^Aff1

المصدر: Transactions of the Indian Institute of Metals. 71(11):2693-2698

المؤلفون: Min Shang, Chong Dong, Haoran Ma, Yunpeng Wang, Haitao Ma

المصدر: Metals, Vol 11, Iss 12, p 2041 (2021)

مصطلحات موضوعية: multiple reflow, Cu concentration, Cu6Sn5 growth, solder property, Mining engineering. Metallurgy, TN1-997

وصف الملف: electronic resource

Relation: https://www.mdpi.com/2075-4701/11/12/2041; https://doaj.org/toc/2075-4701

URL الوصول: https://doaj.org/article/392ff172e3ff4bb7b60bbe6bb6d84ab0