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1مؤتمر
المؤلفون: Chen, Ming-Qiang, Zhou, Min-Bo, Li, Yun-Wei, Zhang, Xin-Ping
المصدر: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2021 22nd International Conference on. :1-5 Sep, 2021
Relation: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT)
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2دورية أكاديمية
المؤلفون: M.S. Chang, M.A.A. Mohd Salleh, D.S.C. Halin, F. Somidin, H. Yasuda, K. Nogita
المصدر: Journal of Materials Research and Technology, Vol 26, Iss , Pp 8670-8687 (2023)
مصطلحات موضوعية: Microalloying, Intermetallic, Multiple reflow, Synchrotron radiography, Mining engineering. Metallurgy, TN1-997
وصف الملف: electronic resource
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3مؤتمر
المؤلفون: Li, Bin, Zhao, Zhenqing, Li, Mingyu, Wang, Tao, Li, Hui
المصدر: 2017 18th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2017 18th International Conference on. :557-560 Aug, 2017
Relation: 2017 18th International Conference on Electronic Packaging Technology (ICEPT)
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4مؤتمر
المصدر: 2017 18th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2017 18th International Conference on. :1402-1405 Aug, 2017
Relation: 2017 18th International Conference on Electronic Packaging Technology (ICEPT)
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5مؤتمر
المؤلفون: Zhou, Min-Bo, Jin, Hong, Ke, Chang-Bo, Zhang, Xin-Ping
المصدر: 2015 16th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2015 16th International Conference on. :333-337 Aug, 2015
Relation: 2015 16th International Conference on Electronic Packaging Technology (ICEPT)
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6مؤتمر
المؤلفون: Branzei, Mihai, Plotog, Ioan, Miculescu, Florin, Varzaru, Gaudentiu, Svasta, Paul, Thumm, Andreas
المصدر: 2012 35th International Spring Seminar on Electronics Technology Electronics Technology (ISSE), 2012 35th International Spring Seminar on. :155-160 May, 2012
Relation: 2012 35th International Spring Seminar on Electronics Technology (ISSE)
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7دورية أكاديمية
المؤلفون: Siti Farahnabilah Muhd Amli, Mohd Arif Anuar Mohd Salleh, Mohd Sharizal Abdul Aziz, Hideyuki Yasuda, Kazuhiro Nogita, Mohd Mustafa Al Bakri Abdullah, Ovidiu Nemes, Andrei Victor Sandu, Petrica Vizureanu
المصدر: Materials, Vol 16, Iss 12, p 4360 (2023)
مصطلحات موضوعية: soldering, primary intermetallics, synchrotron, multiple reflow, finite element, Technology, Electrical engineering. Electronics. Nuclear engineering, TK1-9971, Engineering (General). Civil engineering (General), TA1-2040, Microscopy, QH201-278.5, Descriptive and experimental mechanics, QC120-168.85
وصف الملف: electronic resource
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8دورية أكاديمية
المؤلفون: Tikale, SanjayAff1, Narayan Prabhu, K.Aff1
المصدر: Transactions of the Indian Institute of Metals. 71(11):2855-2859
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9دورية أكاديمية
المؤلفون: Tikale, SanjayAff1, Prabhu, K. NarayanAff1
المصدر: Transactions of the Indian Institute of Metals. 71(11):2693-2698
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10دورية أكاديمية
المؤلفون: Min Shang, Chong Dong, Haoran Ma, Yunpeng Wang, Haitao Ma
المصدر: Metals, Vol 11, Iss 12, p 2041 (2021)
مصطلحات موضوعية: multiple reflow, Cu concentration, Cu6Sn5 growth, solder property, Mining engineering. Metallurgy, TN1-997
وصف الملف: electronic resource