المؤلفون: null DeokYoung Jung, null Kwang-Jin Moon, null Byung-Lyul Park, null Gilheyun Choi, null Ho-Kyu Kang, null Chilhee Chung, null Deok Young Jung, null Yonghan Rho

المصدر: 2012 SEMI Advanced Semiconductor Manufacturing Conference.

مصطلحات موضوعية: Materials science, Through-silicon via, business.industry, Stacking, Electrical engineering, Three-dimensional integrated circuit, Hardware_PERFORMANCEANDRELIABILITY, Form factor (design), Semiconductor, Hardware_INTEGRATEDCIRCUITS, Bandwidth (computing), Optoelectronics, Isolation (database systems), business, Mobile device

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_________::c6dac8005e60054c27102f0e5b3e24b9
https://doi.org/10.1109/asmc.2012.6212888