المؤلفون: Liu, Hong'e, Zhao, Ting, Fan, Wen-Tao, Liu, Jian, Shen, Jia-Xin, Li, Yan-Long

المصدر: 2023 International Conference on Sensing, Measurement & Data Analytics in the era of Artificial Intelligence (ICSMD) Sensing, Measurement & Data Analytics in the era of Artificial Intelligence (ICSMD), 2023 International Conference on. :1-4 Nov, 2023

Relation: 2023 International Conference on Sensing, Measurement & Data Analytics in the era of Artificial Intelligence (ICSMD)

المؤلفون: Wang, Yu, Wang, Yangyang, Zhang, Tianheng, Peng, Donglin

المصدر: 2023 IEEE 16th International Conference on Electronic Measurement & Instruments (ICEMI) Electronic Measurement & Instruments (ICEMI), 2023 IEEE 16th International Conference on. :57-62 Aug, 2023

Relation: 2023 IEEE 16th International Conference on Electronic Measurement & Instruments (ICEMI)

المؤلفون: Tang, Guoxin^{Aff1, Aff2}, Lu, Yi^{Aff1, IDs10973024133141_cor2}, Shi, Shiliang, Wu, Fanghua, Tong, Lin, Zhu, Shuangjiang, Zhang, Shulin, Wang, Zheng, Guo, Xin

المصدر: Journal of Thermal Analysis and Calorimetry: An International Forum for Thermal Studies. :1-15

المؤلفون: Chen, Wei, Yan, Xuyang, Ibrahim, Mesfin S., Meda, Abdulmelik H., Fan, Xuejun, Zhang, Guoqi, Fan, Jiajie

المصدر: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :2007-2011 May, 2023

Relation: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)

المؤلفون: Zhang, Yongliang^{Aff1, Aff2}, Yin, Shili^{Aff1, Aff2, IDs122730241105x_cor2}, Mu, Hongwei^{Aff1, Aff2}, Zhang, Xilong^{Aff1, Aff2}, Tan, Qinglei^{Aff1, Aff2}, Shao, Bing^{Aff1, Aff2}

المصدر: Building Simulation: An International Journal. 17(5):785-798

المؤلفون: Yan, Lan, Luo, Kunhui, Jiang, Tao, Xie, Hong, Li, Yousheng, Xiang, Zhiyang, Jiang, Feng^{Aff2, IDs00170024133152_cor7}

المصدر: The International Journal of Advanced Manufacturing Technology. 131(9-10):4797-4810

المؤلفون: Zheng, Maosheng^{Aff1, IDs43995023000402_cor1}, Yu, Jie

المصدر: Journal of Umm Al-Qura University for Engineering and Architecture. 15(1):55-59

المؤلفون: Wu, S., Zhan, Z., Tan, K.C., Zhang, J.

المصدر: IEEE Transactions on Evolutionary Computation IEEE Trans. Evol. Computat. Evolutionary Computation, IEEE Transactions on. 27(1):185-200 Feb, 2023

المؤلفون: Teng, Yucheng, Han, Baoqing, Liu, Shaoyi, Liu, Jing, Lin, Kabin, Xue, Song, Yao, Songjie, Zhang, Daxing, Wang, Congsi

المصدر: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2022 23rd International Conference on. :1-5 Aug, 2022

Relation: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT)

المؤلفون: Dong, Ruiqi, Wu, Jiahui, Xi, Zhendong, Yan, Guoyi

المصدر: 2022 5th International Conference on Data Science and Information Technology (DSIT) Data Science and Information Technology (DSIT), 2022 5th International Conference on. :1-6 Jul, 2022

Relation: 2022 5th International Conference on Data Science and Information Technology (DSIT)