يعرض 1 - 10 نتائج من 9,493 نتيجة بحث عن '"out-of-plane"', وقت الاستعلام: 0.83s تنقيح النتائج
  1. 1
    مؤتمر
    Experimentally Validated Thermal Modeling Prediction for BEOL and BSPDN Stacks

    المؤلفون: Chang, Xinyue, Oprins, Herman, Vermeersch, Bjorn, Cherman, Vladimir, Lofrano, Melina, Park, Seongho, Tokei, Zsolt, De Wolf, Ingrid

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :498-505 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  2. 2
    مؤتمر
    Impact of Electric Field on the Perpendicular Magnetic Anisotropy of CrMnS₂I₂ Monolayer- A DFT Perspective

    المؤلفون: Mishra, Neha, Ranjan, Prabhat, Dasgupta, Avirup, Roy, Sourajeet

    المصدر: 2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) Electron Devices Technology & Manufacturing Conference (EDTM), 2024 8th IEEE. :1-3 Mar, 2024

    Relation: 2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)

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  3. 3
    دورية أكاديمية
    Multi Degrees-of-Freedom Hybrid Piezoelectric-Electrostatic MEMS Actuators Integrated With Displacement Sensors

    المؤلفون: Rabih, A.A.S., Nabavi, S., Menard, M., Nabki, F.

    المصدر: Journal of Microelectromechanical Systems J. Microelectromech. Syst. Microelectromechanical Systems, Journal of. 33(1):21-36 Feb, 2024

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  4. 4
    مؤتمر
    Initial Approach Segment Control for Out-of-Plane Capture Based on a Space Tether System

    المؤلفون: Xiaoxiao, Liu, Aijun, Li, Changqing, Wang, Hongshi, Lu

    المصدر: 2023 China Automation Congress (CAC) Automation Congress (CAC), 2023 China. :1011-1016 Nov, 2023

    Relation: 2023 China Automation Congress (CAC)

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  5. 5
    دورية أكاديمية
    Challenges in Implementing Pitch/Roll Rate Integrating Gyroscopes: A Case Study on a New Dynamically Balanced Dual-Mass Resonator

    المؤلفون: Wang, S., Chen, J., Tsukamoto, T., Langfelder, G., Tanaka, S.

    المصدر: IEEE Sensors Journal IEEE Sensors J. Sensors Journal, IEEE. 23(22):27068-27075 Nov, 2023

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  6. 6
    مؤتمر
    Design and Analysis of a Novel 3-DOF Out-of-plane Micropositioning Mechanism

    المؤلفون: Lai, Kai Zhong, Tran, Kim Sang, Shirinzadeh, Bijan, Ehrampoosh, Armin, Tian, Yanling, Qin, Yanding

    المصدر: 2023 26th International Conference on Mechatronics Technology (ICMT) Mechatronics Technology (ICMT), 2023 26th International Conference on. :1-3 Oct, 2023

    Relation: 2023 26th International Conference on Mechatronics Technology (ICMT)

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  7. 7
    مؤتمر
    A Flexible PCB Based Out of Plane Bimorph MEMS Thermal Actuator

    المؤلفون: Chen, T., Shafai, C.

    المصدر: 2023 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS) Flexible and Printable Sensors and Systems (FLEPS), 2023 IEEE International Conference on. :1-4 Jul, 2023

    Relation: 2023 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)

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  8. 8
    مؤتمر
    By Varying The Distance Of Ni Flux-Guide For Out-Of-Plane Magnetic Field Sensitivity Enhancement Of Amr Sensor

    المؤلفون: Lin, Shihwei, Lai, Meifeng, Fang, Weileun

    المصدر: 2023 22nd International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers) Solid-State Sensors, Actuators and Microsystems (Transducers), 2023 22nd International Conference on. :1735-1738 Jun, 2023

    Relation: 2023 22nd International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers)

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  9. 9
    مؤتمر
    Evaluation Method of Out-of-Plane Deformation on Kirigami Structure with Repetitive Slit Patterns on Concentric Circles

    المؤلفون: Mizuna, Miyako, Iwase, Eiji

    المصدر: 2023 22nd International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers) Solid-State Sensors, Actuators and Microsystems (Transducers), 2023 22nd International Conference on. :1950-1953 Jun, 2023

    Relation: 2023 22nd International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers)

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  10. 10
    مؤتمر
    Thermal Diffusivity Materials Characterization via Active Microwave Thermography

    المؤلفون: Wilcox, Logan M., Donnell, Kristen M.

    المصدر: 2023 IEEE International Instrumentation and Measurement Technology Conference (I2MTC) Instrumentation and Measurement Technology Conference (I2MTC), 2023 IEEE International. :1-6 May, 2023

    Relation: 2023 IEEE International Instrumentation and Measurement Technology Conference (I2MTC)

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