المؤلفون: O'Sullivan, Brendan, Pavlovic, Zoran, Fiebig, Norbert, O'Mathuna, Cian, O'Driscoll, Seamus

المصدر: 2023 IEEE Applied Power Electronics Conference and Exposition (APEC) Applied Power Electronics Conference and Exposition (APEC), 2023 IEEE. :294-300 Mar, 2023

Relation: 2023 IEEE Applied Power Electronics Conference and Exposition (APEC)

المؤلفون: Le, H.T., Nour, Y., Jensen, F., Knott, A., Han, A., Ouyang, Z.

المصدر: IEEE Transactions on Power Electronics IEEE Trans. Power Electron. Power Electronics, IEEE Transactions on. 38(6):6755-6758 Jun, 2023

المؤلفون: Hou, Zhaozheng, Liao, Xiaojing, Peng, Hao, Wang, Yiyu

المصدر: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2022 23rd International Conference on. :1-4 Aug, 2022

Relation: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT)

المؤلفون: Lee, Jinhen, Adrian, Victor, Chang, Joseph, Sun, Yin, Tay, Sun-Yang

المصدر: 2022 IEEE International Symposium on Circuits and Systems (ISCAS) Circuits and Systems (ISCAS), 2022 IEEE International Symposium on. :3053-3057 May, 2022

Relation: 2022 IEEE International Symposium on Circuits and Systems (ISCAS)

المؤلفون: Shetty, C., Kandeel, Y., Ye, L., O'Driscoll, S., McCloskey, P., Duffy, M., Mathuna, C.O.

المصدر: IEEE Journal of Emerging and Selected Topics in Power Electronics IEEE J. Emerg. Sel. Topics Power Electron. Emerging and Selected Topics in Power Electronics, IEEE Journal of. 10(2):1363-1383 Apr, 2022

المؤلفون: Dinulovic, Dragan, Haase, Leon, Haug, Martin, Wolf, Jurgen

المصدر: 2021 Third International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM) 3D Power Electronics Integration and Manufacturing (3D-PEIM), 2021 Third International Symposium on. :1-4 Jun, 2021

Relation: 2021 Third International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM)

المؤلفون: Alvarez Barros, C., Murali, P., Swaminathan, M., Yusuke, O., Junichi, T., Ryo, N., Watanabe, N.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 11(12):2183-2192 Dec, 2021

المؤلفون: Barros, C.A., Murali, P., Swaminathan, M., Yusuke, O., Junichi, T., Ryo, N., Watanabe, N.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 11(11):1935-1947 Nov, 2021

المؤلفون: Kamilla Wiull, Live Heldal Hagen, Jelena Rončević, Bjørge Westereng, Preben Boysen, Vincent G. H. Eijsink, Geir Mathiesen

المصدر: Microbial Cell Factories, Vol 23, Iss 1, Pp 1-17 (2024)

مصطلحات موضوعية: L. pentosus, Heterologous protein expression, pSIP, Adjuvancy, Exopolysaccharides, Microbiology, QR1-502

وصف الملف: electronic resource

Relation: https://doaj.org/toc/1475-2859

URL الوصول: https://doaj.org/article/66d2d3eb94524e709fc19a24101c6ef7

المؤلفون: Doyle, James T., Stiff, Jonathon C., Kulkarni, Santosh, Yildiz, Aysel

المصدر: 2019 IEEE Custom Integrated Circuits Conference (CICC) Custom Integrated Circuits Conference (CICC), 2019 IEEE. :1-8 Apr, 2019

Relation: 2019 IEEE Custom Integrated Circuits Conference (CICC)