المؤلفون: Lin, Guan-Yu, Lin, Po-Chen, Lee, Chao-Chin, Chiu, Po-Wei, Youn, Jinsung, Lee, Youngsoo, Shi, Hong, Fang, Alan, Asuncion, Santiago

المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :913-916 May, 2024

Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

المؤلفون: Zhang, L., Lai, X., Jia, K., Ma, Y., Xiao, Q., Jia, B.

المصدر: IEEE Sensors Journal IEEE Sensors J. Sensors Journal, IEEE. 24(9):14306-14312 May, 2024

المؤلفون: Wang, Jiahui

المصدر: 2024 International Conference on Integrated Circuits and Communication Systems (ICICACS) Integrated Circuits and Communication Systems (ICICACS), 2024 International Conference on. :1-4 Feb, 2024

Relation: 2024 International Conference on Integrated Circuits and Communication Systems (ICICACS)

المؤلفون: Hsu, Yun-Ting, Zou, Yung-Sheng, Chung, Min-Hua, Gan, Chong-Leong, Venkatraman, Venkatesh, Paul, Anila, Low, Winnie, Che, Faxing

المصدر: 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2023 IEEE International Symposium on the. :1-5 Jul, 2023

Relation: 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

المؤلفون: Jiang, Xinbo, Ni, Lehan

المصدر: 2023 IEEE 5th International Conference on Power, Intelligent Computing and Systems (ICPICS) Power, Intelligent Computing and Systems (ICPICS), 2023 IEEE 5th International Conference on. :1091-1099 Jul, 2023

Relation: 2023 IEEE 5th International Conference on Power, Intelligent Computing and Systems (ICPICS)

المؤلفون: Yoshida, Satoshi, Yasuzumi, Takenori, Tanaka, Tsuguhiro, Fujiwara, Yasuyuki

المصدر: 2023 35th International Symposium on Power Semiconductor Devices and ICs (ISPSD) Power Semiconductor Devices and ICs (ISPSD), 2023 35th International Symposium on. :56-59 May, 2023

Relation: 2023 35th International Symposium on Power Semiconductor Devices and ICs (ISPSD)

المؤلفون: Liu, Duixian, Gu, Xiaoxiong, Baks, Christian, Masuko, Koichiro, Tojo, Yujiro, Watanabe, Atom O., Paidimarri, Arun, Hasegawa, Yuta, Chandran, Gokul, Lei, Xu, Guan, Ning, Valdes-Garcia, Alberto, Sadhu, Bodhisatwa

المصدر: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :467-474 May, 2023

Relation: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)

المؤلفون: Nie, Ronghuai, Huang, Kun, Zhang, Liang, Jiang, Jun, Ding, Jiangqiao

المصدر: 2023 International Conference on Microwave and Millimeter Wave Technology (ICMMT) Microwave and Millimeter Wave Technology (ICMMT), 2023 International Conference on. :1-3 May, 2023

Relation: 2023 International Conference on Microwave and Millimeter Wave Technology (ICMMT)

المؤلفون: Yin, P., Park, S., Jacob, B., Gowda, A.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 13(5):638-645 May, 2023

المؤلفون: El Oraiby, Maryam, Kiygi-Calli, Meltem^{Aff1, IDs13165023004461_cor2}

المصدر: Organic Agriculture: Official journal of The International Society of Organic Agriculture Research. 14(2):143-165