يعرض 1 - 10 نتائج من 84,413 نتيجة بحث عن '"passivation"', وقت الاستعلام: 1.55s تنقيح النتائج
  1. 1
    رسالة جامعية
    Structural and Processing Modification of Perovskite for the Optimization of Photovoltaic Devices

    المؤلفون: Serafini, Patricio

    المساهمون: University/Department: Universitat Jaume I. Escola de Doctorat

    مرشدي الرسالة: Mora Seró, Iván, Barea, Eva M

    المصدر: TDX (Tesis Doctorals en Xarxa)

    مصطلحات موضوعية: Halide perovskites, Passivation, Stability, Additives, Strain, flash infrared annealing, Ciències

    وصف الملف: application/pdf

    URL الوصول: http://hdl.handle.net/10803/689515

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  2. 2
    دورية أكاديمية
    Low-Temperature Area-Selective Metal Passivation Bonding Platform for Heterogeneous Integration

    المؤلفون: Hsu, M., Tsai, W., Chen, C., Kuo, T., Lee, O., Chang, H., Chen, K.

    المصدر: IEEE Electron Device Letters IEEE Electron Device Lett. Electron Device Letters, IEEE. 45(7):1273-1276 Jul, 2024

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  3. 3
    دورية أكاديمية
    Comprehensively Enhanced Performance of MISIM β-Ga₂O₃ Solar-Blind Photodetector Inserted With an Ultrathin Al₂O₃ Passivation Layer

    المؤلفون: Tian, J., Song, X., Yang, S., Chen, B., Lei, S., Zhang, X., Qian, L.

    المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 71(6):3746-3752 Jun, 2024

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  4. 4
    دورية أكاديمية
    Insulated p-GaN Gate Active-Passivation HEMT Maintaining Effective Hole Injection for Low Dynamic ON-Resistance

    المؤلفون: Yang, J., Wei, J., Wang, M., Yu, J., Wu, Y., Cui, J., Li, T., Yang, X., Wang, J., Shen, B.

    المصدر: IEEE Electron Device Letters IEEE Electron Device Lett. Electron Device Letters, IEEE. 45(6):980-983 Jun, 2024

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  5. 5
    دورية أكاديمية
    A Review: Breakdown Voltage Enhancement of GaN Semiconductors-Based High Electron Mobility Transistors

    المؤلفون: Cicek, O., Badali, Y.

    المصدر: IEEE Transactions on Device and Materials Reliability IEEE Trans. Device Mater. Relib. Device and Materials Reliability, IEEE Transactions on. 24(2):275-286 Jun, 2024

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  6. 6
    دورية أكاديمية
    8F² Ternary Content Addressable Memory Array Utilizing Interface Passivated Ge Memory-Diodes With 2 × 10⁵ Self-Rectifying Ratio

    المؤلفون: Ding, X., Zhang, H., Wang, X., Zhou, X., Lee, C., Zhao, Y.

    المصدر: IEEE Electron Device Letters IEEE Electron Device Lett. Electron Device Letters, IEEE. 45(5):833-836 May, 2024

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  7. 7
    مؤتمر
    Low Temperature Cu/SiO2 Hybrid Bonding Using Area-Selective Metal Passivation (Interface Metal) Technology for 3D IC and Advanced Packaging

    المؤلفون: Hsu, Mu-Ping, Tsai, Wen-Tsu, Lee, Ou-Hsiang, Chen, Chi-Yu, Kuo, Tzu-Ying, Chang, Hsiang-Hung, Chang, Hsin-Chi, Hong, Zhong-Jie, Chen, Kuan-Neng

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :2131-2135 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  8. 8
    مؤتمر
    Comparison of Different Copper Nitride Passivation Layers Fabrication Methodology and Optimal Growth Condition for Low Temperature Copper-to-Copper Bonding in Advanced Packaging

    المؤلفون: Wang, Chiao-Yen, Hung, Tzu-Heng, Liu, Ping-Jung, Chen, Kuan-Neng

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :2157-2162 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  9. 9
    مؤتمر
    Wet Cu passivation for high throughput fluxless Thermal Compression Bonding of Cu-Sn μbumps for Die-to-Wafer stacking

    المؤلفون: Rip, Jens, Derakhshandeh, Jaber, Negishi, Ryo, Tomatsu, Itsuro, Cuypers, Dieter H., Beyne, Eric

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1859-1862 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  10. 10
    مؤتمر
    Modeling and Optimization of Thermal Cycling Performance to Reduce Ratcheting-Induced Passivation Cracking in High-Voltage Power Modules

    المؤلفون: Chen, Liangbiao, Liu, Yong

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :215-220 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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