يعرض 1 - 10 نتائج من 61,854 نتيجة بحث عن '"paste"', وقت الاستعلام: 1.78s تنقيح النتائج
  1. 1
    مؤتمر
    Evaluating the Efficacy of Cut-and-Paste Data Augmentation in Semantic Segmentation for Satellite Imagery

    المؤلفون: Motoi, Ionut M., Saraceni, Leonardo, Nardi, Daniele, Ciarfuglia, Thomas A.

    المصدر: IGARSS 2024 - 2024 IEEE International Geoscience and Remote Sensing Symposium Geoscience and Remote Sensing Symposium, IGARSS 2024 - 2024 IEEE International. :9802-9806 Jul, 2024

    Relation: IGARSS 2024 - 2024 IEEE International Geoscience and Remote Sensing Symposium

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  2. 2
    مؤتمر
    In-Situ Reduction Sintering of Micro-Copper Paste for High-Power Electronic Application

    المؤلفون: Xiao, Nan, Liu, Yang, Li, Ke, Zhang, Jing

    المصدر: 2024 25th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2024 25th International Conference on. :1-4 Aug, 2024

    Relation: 2024 25th International Conference on Electronic Packaging Technology (ICEPT)

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  3. 3
    مؤتمر
    Solutions for Voiding Control of Lead-Free Soldering at QFN Application

    المؤلفون: Ma, Li, Bai, Jinjin, Chen, Fen, Liu, Yan

    المصدر: 2024 25th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2024 25th International Conference on. :1-5 Aug, 2024

    Relation: 2024 25th International Conference on Electronic Packaging Technology (ICEPT)

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  4. 4
    مؤتمر
    Bonding Performance of Pressure Copper Sintering Paste on Different Metalized Substrate/Die

    المؤلفون: Lu, Xiaoqin, Yao, Min, Ma, Li, Wu, Yan, Li, Meng, Li, Hongyun, Chen, Fen, Liu, Yan

    المصدر: 2024 25th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2024 25th International Conference on. :1-5 Aug, 2024

    Relation: 2024 25th International Conference on Electronic Packaging Technology (ICEPT)

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  5. 5
    مؤتمر
    Effects of Silver Particle Size on Thermal Expansion Behavior of Low-Temperature-Sintered Silver Paste

    المؤلفون: Hao, Shijie, Liu, Zhuofeng, Xun, Yan, Wu, Chunran, Li, Wei, Wang, Fenglin

    المصدر: 2024 25th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2024 25th International Conference on. :1-4 Aug, 2024

    Relation: 2024 25th International Conference on Electronic Packaging Technology (ICEPT)

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  6. 6
    مؤتمر
    Non-Pressure Cu Sinter Paste for High Density Power Device Interconnection

    المؤلفون: Gao, Yue, Wang, Jianhao, He, Yiting, Liu, Wenting, Zhang, Jing, Liu, Pan

    المصدر: 2024 25th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2024 25th International Conference on. :1-4 Aug, 2024

    Relation: 2024 25th International Conference on Electronic Packaging Technology (ICEPT)

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  7. 7
    مؤتمر
    Properties of activated formic acid using for low- temperature all-copper interconnect assisted with nanoparticles paste

    المؤلفون: Kong, Mengdan, Li, Junjie, Cao, Ruizhi, Li, Junlong, Mu, Fengwen

    المصدر: 2024 25th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2024 25th International Conference on. :01-05 Aug, 2024

    Relation: 2024 25th International Conference on Electronic Packaging Technology (ICEPT)

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  8. 8
    مؤتمر
    Evaluating the Performance of Micro-Bump Flip-Chip Packaging Enhanced by Copper Paste

    المؤلفون: Liu, Ran, Zhang, Zheng, Nishijima, Masahiko, Chen, Chuantong, Sakamoto, Hirokatsu, Happoya, Akihiko, Suganuma, Katsuaki

    المصدر: 2024 25th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2024 25th International Conference on. :1-4 Aug, 2024

    Relation: 2024 25th International Conference on Electronic Packaging Technology (ICEPT)

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  9. 9
    مؤتمر
    Plated Copper on Thick Film Ceramic Substrates and Their Packaging Applications for Deep-Ultraviolet LEDs

    المؤلفون: Ding, Yongjie, Wang, Qing, Peng, Yang, Chen, Mingxiang

    المصدر: 2024 25th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2024 25th International Conference on. :1-5 Aug, 2024

    Relation: 2024 25th International Conference on Electronic Packaging Technology (ICEPT)

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  10. 10
    مؤتمر
    Interconnection-Varied Warpage Modeling of Sintered-Nanosilver-Connected Power Modules with a Heatsink Considering Time Sequence Efforts

    المؤلفون: Zhu, Gaojia, Zhang, Lijuan, Hou, Zhaozheng, Wang, Yiyu, Liang, Lijun, Mei, Yun-Hui

    المصدر: 2024 25th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2024 25th International Conference on. :01-05 Aug, 2024

    Relation: 2024 25th International Conference on Electronic Packaging Technology (ICEPT)

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