المؤلفون: Das, Priyanka, Sarker, Hasan, Amin, Shahriar

المصدر: 2023 26th International Conference on Computer and Information Technology (ICCIT) Computer and Information Technology (ICCIT), 2023 26th International Conference on. :1-5 Dec, 2023

Relation: 2023 26th International Conference on Computer and Information Technology (ICCIT)

المؤلفون: Gupta, Debaleena Datta, Kundu, Susmoy, Haque, Emranul, Noman, Abdullah Al, Hai, Nguyen Hoang, Hossain, Md. Anwar, Ahmed, Feroz

المصدر: 2022 International Conference on Advanced Technologies for Communications (ATC) Advanced Technologies for Communications (ATC), 2022 International Conference on. :315-321 Oct, 2022

Relation: 2022 International Conference on Advanced Technologies for Communications (ATC)

المؤلفون: Keya, Riziya Akter, Khaleque, Abdul, Shaha, Kumary Sumi Rani, Akter, Sumaya, Hosen, Md. Sarwar

المصدر: 2021 3rd International Conference on Electrical & Electronic Engineering (ICEEE) Electrical & Electronic Engineering (ICEEE), 2021 3rd International Conference on. :61-64 Dec, 2021

Relation: 2021 3rd International Conference on Electrical & Electronic Engineering (ICEEE)

المؤلفون: Rahman, K M Mustafizur, Rahman, Sajjadur

المصدر: 2021 5th International Conference on Electrical Engineering and Information Communication Technology (ICEEICT) Electrical Engineering and Information Communication Technology (ICEEICT), 2021 5th International Conference on. :1-6 Nov, 2021

Relation: 2021 5th International Conference on Electrical Engineering and Information Communication Technology (ICEEICT)

المؤلفون: Li, T., Zhu, L., Lu, L., You, R., Bian, X., Ren, G., Yu, L.

المصدر: IEEE Sensors Journal IEEE Sensors J. Sensors Journal, IEEE. 22(8):7734-7742 Apr, 2022

المؤلفون: Himanshu Ranjan Das

المصدر: e-Prime: Advances in Electrical Engineering, Electronics and Energy, Vol 9, Iss , Pp 100706- (2024)

مصطلحات موضوعية: Electro-absorption modulator, Plasmonic material, Dielectric material, Insertion loss, Electrical engineering. Electronics. Nuclear engineering, TK1-9971

وصف الملف: electronic resource

Relation: http://www.sciencedirect.com/science/article/pii/S2772671124002869; https://doaj.org/toc/2772-6711

URL الوصول: https://doaj.org/article/28ebd5d1cbf344359b287fb5fb965ac6

المؤلفون: Zhou, Yaxin, Feng, Hengli, Li, Xin, Sun, Pengfei, Su, Lijing, Nie, Sihan, Ran, Lingling, Gao, Yang^{Aff1, Aff2, IDs11468023019551_cor8}

المصدر: Plasmonics. 18(6):2465-2473

المؤلفون: Siddik, M.A.B., Hossain, M.S., Paul, A.K., Rahman, M.M., Roni, M.H.K., Chakrabatri, K.

المصدر: 2020 IEEE Region 10 Symposium (TENSYMP) Region 10 Symposium (TENSYMP), 2020 IEEE. :1795-1799 Jun, 2020

Relation: 2020 IEEE Region 10 Symposium (TENSYMP)

المؤلفون: Mahmud, Iffat, Shushama, Kamrun Nahar, Khaleque, Abdul, Paul, Alok Kumar, Hossain, Sunjidah, Hossain, Mushfica

المصدر: 2019 IEEE International Conference on Telecommunications and Photonics (ICTP) Telecommunications and Photonics (ICTP), 2019 IEEE International Conference on. :1-4 Dec, 2019

Relation: 2019 IEEE International Conference on Telecommunications and Photonics (ICTP)

المؤلفون: Yamanaka, Junpei^Aff13, Okuzono, Tohru^Aff13, Toyotama, Akiko^Aff13

المساهمون: Carpenter, Barry, Series Editor^Aff1, Ceroni, Paola, Series Editor^Aff2, Landfester, Katharina, Series Editor^Aff3, Leszczynski, Jerzy, Series Editor^Aff4, Luh, Tien-Yau, Series Editor^Aff5, Perlt, Eva, Series Editor^Aff6, Polfer, Nicolas C., Series Editor^Aff7, Salzer, Reiner, Series Editor^Aff8, Saito, Kazuya, Series Editor^Aff9, Yamanaka, Junpei^Aff10, Okuzono, Tohru^Aff11, Toyotama, Akiko^Aff12

المصدر: Colloidal Self-Assembly. 108:157-184