يعرض 1 - 10 نتائج من 2,518 نتيجة بحث عن '"plated"', وقت الاستعلام: 0.99s تنقيح النتائج
  1. 1
    مؤتمر
    Experimental Studies of High Frequency Performances of Plated Through Hole and Coaxial Via in Printed Circuit Boards Up to 110 GHz

    المؤلفون: Huang, Chien-Chang, Liu, Pin-Xian, Liu, Yu-Chen

    المصدر: 2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa) Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa), 2024 IEEE Joint International Symposium on. :183-185 May, 2024

    Relation: 2024 IEEE Joint International Symposium on Electromagnetic Compatibility, Signal & Power Integrity: EMC Japan / Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Japan/APEMC Okinawa)

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  2. 2
    دورية أكاديمية
    A Review: Breakdown Voltage Enhancement of GaN Semiconductors-Based High Electron Mobility Transistors

    المؤلفون: Cicek, O., Badali, Y.

    المصدر: IEEE Transactions on Device and Materials Reliability IEEE Trans. Device Mater. Relib. Device and Materials Reliability, IEEE Transactions on. 24(2):275-286 Jun, 2024

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  3. 3
    مؤتمر
    Study of Galvanic Effect Factor and Mechanism for Ni/Au Plated Substrate

    المؤلفون: He, MJ, Ye, Rick, Pai, Yu Cheng, Wang, Yu-Po

    المصدر: 2024 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2024 International Conference on. :143-144 Apr, 2024

    Relation: 2024 International Conference on Electronics Packaging (ICEP)

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  4. 4
    دورية أكاديمية
    Parallel-Stranded Spiral Structure of Artificial Muscle Based on Polyethylene Fiber and Silver-Plated Nylon Wire

    المؤلفون: Han, YaliAff1, IDs12221024006322_cor1, Li, Yang, Wang, Junjie, Zhu, Songqing

    المصدر: Fibers and Polymers. 25(8):3151-3163

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  5. 5
    دورية أكاديمية
    Effects of Carbon Nanotubes and Nickel-Plated Carbon Nanotubes on the Microstructure and Mechanical Properties of AlCoCrFeNiCu High Entropy Alloy

    المؤلفون: Lv, Jiahao, Du, JinghongAff1, IDs12540024016393_cor2, Hu, Rong, He, Shengyang, Chen, Jiaxing, Qin, Chaoqian, Wang, Zilong, Gou, Yi, Zhang, Rongrong

    المصدر: Metals and Materials International. 30(8):2331-2341

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  6. 6
    دورية أكاديمية
    Extraction of silica from rice husk for rubber-cord adhesion systems of tire industry

    المؤلفون: Shiva, MehdiAff1, IDs13399023038938_cor1, Golmohammadi, Morteza, Nouroozi, Fatemeh

    المصدر: Biomass Conversion and Biorefinery: Processing of Biogenic Material for Energy and Chemistry. 14(15):17717-17729

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  7. 7
    مؤتمر
    Diagnostics of a Future Blow Hole Issue Before Assembly

    المؤلفون: Busek, David, Vondrous, Petr, Mach, Pavel, Dusek, Karel

    المصدر: 2023 46th International Spring Seminar on Electronics Technology (ISSE) Electronics Technology (ISSE), 2023 46th International Spring Seminar on. :1-4 May, 2023

    Relation: 2023 46th International Spring Seminar on Electronics Technology (ISSE)

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  8. 8
    دورية أكاديمية
    Conceptual Design of Scanning Magnets Using HTS Coils Wound With Spiral Copper-Plated Striated Coated-Conductor (SCSC) Cables for Carbon-ion Radiotherapy

    المؤلفون: Li, Y., Sogabe, Y., Iwata, Y., Amemiya, N.

    المصدر: IEEE Transactions on Applied Superconductivity IEEE Trans. Appl. Supercond. Applied Superconductivity, IEEE Transactions on. 33(5):1-5 Aug, 2023

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  9. 9
    دورية أكاديمية
    Influence of Non-Uniform Current Distribution Among Layers on AC Loss Characteristics of Multilayer Spiral Copper-Plated Striated Coated-Conductor Cables

    المؤلفون: Sogabe, Y., Ezaki, Y., Amemiya, N.

    المصدر: IEEE Transactions on Applied Superconductivity IEEE Trans. Appl. Supercond. Applied Superconductivity, IEEE Transactions on. 33(5):1-5 Aug, 2023

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  10. 10
    دورية أكاديمية
    Enhanced Optical–Thermal Performances of High-Power LED by Plated Copper on Thick Film Ceramic Substrate

    المؤلفون: Luo, T., Tong, Y., Lu, J., Mou, Y., Wang, Q., Liu, J., Peng, Y., Chen, M.

    المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 70(7):3774-3779 Jul, 2023

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