المؤلفون: You, Yimin, Wang, Lizhi, Dai, Dongyun, Pan, Yiwei

المصدر: 2024 7th International Conference on Energy, Electrical and Power Engineering (CEEPE) Energy, Electrical and Power Engineering (CEEPE), 2024 7th International Conference on. :34-40 Apr, 2024

Relation: 2024 7th International Conference on Energy, Electrical and Power Engineering (CEEPE)

المؤلفون: Liu, Z., Xu, Y., Wang, X., Zou, X.

المصدر: IEEE Transactions on Plasma Science IEEE Trans. Plasma Sci. Plasma Science, IEEE Transactions on. 51(10):3205-3210 Oct, 2023

المؤلفون: Ravsher, Taras, Degraeve, Robin, Garbin, Daniele, Clima, Sergiu, Fantini, Andrea, Donadio, Gabriele, Kundu, Shreya, Devulder, Wouter, Hody, Hubert, Potoms, Goedele, Van Houdt, Jan, Afanas'ev, Valeri, Belmonte, Attilio, Kar, Gouri

المصدر: 2024 IEEE International Reliability Physics Symposium (IRPS) International Reliability Physics Symposium (IRPS), 2024 IEEE. :7A.5-1-7A.5-9 Apr, 2024

Relation: 2024 IEEE International Reliability Physics Symposium (IRPS)

المؤلفون: Liu, Jianben, Liu, Yan, Chen, Junhong, Li, Jinshu, Dong, Junhao, Deng, Junbo

المصدر: 2023 IEEE 6th International Electrical and Energy Conference (CIEEC) Electrical and Energy Conference (CIEEC), 2023 IEEE 6th International. :2621-2625 May, 2023

Relation: 2023 IEEE 6th International Electrical and Energy Conference (CIEEC)

المؤلفون: Liu, H., Zhang, Z., Liu, S.

المصدر: IEEE Transactions on Plasma Science IEEE Trans. Plasma Sci. Plasma Science, IEEE Transactions on. 51(8):2331-2336 Aug, 2023

المؤلفون: Ravsher, T., Garbin, D., Fantini, A., Degraeve, R., Clima, S., Donadio, G.L., Kundu, S., Hody, H., Devulder, W., Van Houdt, J., Afanas'ev, V., Delhougne, R., Kar, G.S.

المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 70(5):2276-2281 May, 2023

المؤلفون: Huang, M., You, W., Wu, Y., Zhang, L., Li, Y., Gao, C., Qi, B.

المصدر: IEEE Transactions on Instrumentation and Measurement IEEE Trans. Instrum. Meas. Instrumentation and Measurement, IEEE Transactions on. 72:1-12 2023

المؤلفون: Chen, Tao, Yang, Donghua, Chen, Yuqian, Chang, Jiwei, Wang, Yuwei, Zhang, Huanhuan, Xiang, Weiguo

المصدر: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2022 23rd International Conference on. :1-5 Aug, 2022

Relation: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT)

المؤلفون: Bahdad, F.O., Chen, L., Ranjan, P., Rowland, S.

المصدر: IEEE Transactions on Dielectrics and Electrical Insulation IEEE Trans. Dielect. Electr. Insul. Dielectrics and Electrical Insulation, IEEE Transactions on. 29(6):2227-2235 Dec, 2022

المؤلفون: Sun, C., Ji, S., Xie, L., Wang, H., Mei, K.

المصدر: IEEE Transactions on Dielectrics and Electrical Insulation IEEE Trans. Dielect. Electr. Insul. Dielectrics and Electrical Insulation, IEEE Transactions on. 29(5):1693-1700 Oct, 2022