المؤلفون: Ahmed, A., Li, D., Fan, Y., Li, R., Zhang, L., Qin, P., Li, E.

المصدر: IEEE Antennas and Wireless Propagation Letters Antennas Wirel. Propag. Lett. Antennas and Wireless Propagation Letters, IEEE. 23(7):2081-2085 Jul, 2024

المؤلفون: Karthikeyan, V., Nidhyananthan, S. Selva, Renganathan, G. Hari, Sri Vishnu, S. I.

المصدر: 2024 5th International Conference on Innovative Trends in Information Technology (ICITIIT) Innovative Trends in Information Technology (ICITIIT), 2024 5th International Conference on. :1-6 Mar, 2024

Relation: 2024 5th International Conference on Innovative Trends in Information Technology (ICITIIT)

المؤلفون: Lall, Pradeep, Naranagaparambil, Jinesh, Miller, Scott

المصدر: 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2023 22nd IEEE Intersociety Conference on. :1-10 May, 2023

Relation: 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

المؤلفون: Lall, Pradeep, Narangaparambil, Jinesh, Soni, Ved, Miller, Scott

المصدر: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :161-168 May, 2023

Relation: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)

المؤلفون: Ahmed, Sanan, Bano, Samreen, Iftikhar, Bakhtawar, Naqvi, Syeda Iffat, Amin, Yasar

المصدر: 2023 4th International Conference on Computing, Mathematics and Engineering Technologies (iCoMET) Computing, Mathematics and Engineering Technologies (iCoMET), 2023 4th International Conference on. :01-04 Mar, 2023

Relation: 2023 4th International Conference on Computing, Mathematics and Engineering Technologies (iCoMET)

المؤلفون: Lall, Pradeep, Narangaparambil, Jinesh, Miller, Scott

المصدر: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2022 21st IEEE Intersociety Conference on. :1-10 May, 2022

Relation: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)

المؤلفون: Lall, Pradeep, Narangaparambil, Jinesh, Schulze, Kyle, Hill, Curtis

المصدر: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2022 21st IEEE Intersociety Conference on. :1-9 May, 2022

Relation: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)

المؤلفون: Lall, Pradeep, Narangaparambil, Jinesh, Miller, Scott

المصدر: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2022 21st IEEE Intersociety Conference on. :1-12 May, 2022

Relation: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)

المؤلفون: Lall, Pradeep, Narangaparambil, Jinesh, Hill, Curtis

المصدر: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2022 21st IEEE Intersociety Conference on. :1-10 May, 2022

Relation: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)

المؤلفون: Lall, Pradeep, Narangaparambil, Jinesh, Miller, Scott

المصدر: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :1172-1183 May, 2022

Relation: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)