يعرض 1 - 10 نتائج من 108 نتيجة بحث عن '"pulse sequence analysis"', وقت الاستعلام: 1.13s تنقيح النتائج
  1. 1
    دورية أكاديمية

    المؤلفون: Meng, X., Li, X., Lu, T.

    المصدر: IEEE Transactions on Dielectrics and Electrical Insulation IEEE Trans. Dielect. Electr. Insul. Dielectrics and Electrical Insulation, IEEE Transactions on. 31(1):212-221 Feb, 2024

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  3. 3
    مؤتمر

    المصدر: 2023 6th International Conference on Contemporary Computing and Informatics (IC3I) Contemporary Computing and Informatics (IC3I), 2023 6th International Conference on. 6:1952-1956 Sep, 2023

    Relation: 2023 6th International Conference on Contemporary Computing and Informatics (IC3I)

  4. 4
    دورية أكاديمية

    المصدر: IEEE Transactions on Plasma Science IEEE Trans. Plasma Sci. Plasma Science, IEEE Transactions on. 51(12):3454-3461 Dec, 2023

  5. 5
    دورية أكاديمية

    المصدر: IEEE Transactions on Dielectrics and Electrical Insulation IEEE Trans. Dielect. Electr. Insul. Dielectrics and Electrical Insulation, IEEE Transactions on. 30(2):658-666 Apr, 2023

  6. 6
    دورية أكاديمية

    المصدر: IEEE Transactions on Dielectrics and Electrical Insulation IEEE Trans. Dielect. Electr. Insul. Dielectrics and Electrical Insulation, IEEE Transactions on. 30(1):421-428 Feb, 2023

  7. 7
    دورية أكاديمية

    المصدر: IEEE Transactions on Dielectrics and Electrical Insulation IEEE Trans. Dielect. Electr. Insul. Dielectrics and Electrical Insulation, IEEE Transactions on. 29(6):2294-2302 Dec, 2022

  8. 8
    مؤتمر

    المصدر: 2021 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP) Electrical Insulation and Dielectric Phenomena (CEIDP), 2021 IEEE Conference on. :195-199 Dec, 2021

    Relation: 2021 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP)

  9. 9
    دورية أكاديمية

    المؤلفون: Chang, C., Chang, H., Boyanapalli, B.K.

    المصدر: IEEE Transactions on Dielectrics and Electrical Insulation IEEE Trans. Dielect. Electr. Insul. Dielectrics and Electrical Insulation, IEEE Transactions on. 29(3):1070-1078 Jun, 2022

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