المؤلفون: Yang, X., Guo, R., Zheng, J., Chen, X., Chen, J.

المصدر: IEEE Transactions on Electromagnetic Compatibility IEEE Trans. Electromagn. Compat. Electromagnetic Compatibility, IEEE Transactions on. 66(4):1029-1040 Aug, 2024

المؤلفون: Rouse, C.D.

المصدر: IEEE Transactions on Electromagnetic Compatibility IEEE Trans. Electromagn. Compat. Electromagnetic Compatibility, IEEE Transactions on. 66(2):392-404 Apr, 2024

المؤلفون: Sinha, Swarnim, Zahra, Andleeb, Siddiqui, Imran, Kumar, Pawan, Modak, Alimpan, Bhimalapuram, Prabhakar, Sau, Tapan, Syed, Azeemuddin, Abbas, Zia

المصدر: 2023 16th International Conference on Sensing Technology (ICST) Sensing Technology (ICST), 2023 16th International Conference on. :1-4 Dec, 2023

Relation: 2023 16th International Conference on Sensing Technology (ICST)

المؤلفون: Beaulieu, P., Dumesnil, E., Nabki, F., Boukadoum, M.

المصدر: IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst. Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on. 42(12):4391-4401 Dec, 2023

المؤلفون: Popova, Kristina I., Lukyanov, Nikolai O., Glybovski, Stanislav B., Solomakha, Georgiy A.

المصدر: 2023 IEEE 24th International Conference of Young Professionals in Electron Devices and Materials (EDM) Young Professionals in Electron Devices and Materials (EDM), 2023 IEEE 24th International Conference of. :1380-1383 Jun, 2023

Relation: 2023 IEEE 24th International Conference of Young Professionals in Electron Devices and Materials (EDM)

المؤلفون: Fellmann, Maxandre, Rivet, Francois, Deltimple, Nathalie, Deval, Yann, Kerherve, Eric

المصدر: 2023 32nd Annual Conference of the European Association for Education in Electrical and Information Engineering (EAEEIE) Electrical and Information Engineering (EAEEIE), 2023 32nd Annual Conference of the European Association for Education in. :1-6 Jun, 2023

Relation: 2023 32nd Annual Conference of the European Association for Education in Electrical and Information Engineering (EAEEIE)

المؤلفون: Boyer, A.

المصدر: IEEE Letters on Electromagnetic Compatibility Practice and Applications IEEE Lett. on Electromagn. Compat. Pract. and Appl. Electromagnetic Compatibility Practice and Applications, IEEE Letters on. 4(4):108-113 Dec, 2022

المؤلفون: Smith, Brett, Lanzerotti, Mary^{Aff1, IDs13634023010930_cor2}

المصدر: EURASIP Journal on Advances in Signal Processing. 2024(1)

المؤلفون: Alizadeh, Zahra^{Aff1, IDs0026602303647x_cor1}, Halabchi, Farzin, Bodaghabadi, Zahra, Zarandi, Marzieh Mahmoudi, Abolhasani, Maryam, Seifi, Vahid, Khazaei, Reyhaneh, Ghanadi, Shima, Mazaheri, Reza, Tabesh, Mastaneh Rajabian

المصدر: Aesthetic Plastic Surgery. 48(4):659-679

المؤلفون: Yanyan Wen, Ningning Song, Yueyou Peng, Weiwei Wu, Qixiong Lin, Minjie Cui, Rongrong Li, Qiufeng Yu, Sixue Wu, Yongkang Liang, Wei Tian, Yanfeng Meng

المصدر: Beilstein Journal of Nanotechnology, Vol 15, Iss 1, Pp 569-579 (2024)

مصطلحات موضوعية: curcumin, hepatocellular carcinoma, magnetic resonance imaging (mri), radiofrequency (rf) hyperthermia, responsive nanoflower, Technology, Chemical technology, TP1-1185, Science, Physics, QC1-999

وصف الملف: electronic resource

Relation: https://doaj.org/toc/2190-4286

URL الوصول: https://doaj.org/article/994550f23431484682c36ec89fb7944a