المؤلفون: Hu, Yuhua, Zhang, Yan, Bao, Zuguo^{Aff2, IDs11664023108811_cor3}, Wu, Jing, Li, Jie, Wu, Jie, Huang, Min

المصدر: Journal of Electronic Materials. 53(3):1414-1424

المؤلفون: Wang, J., Wang, Y., Wu, Y., Zhang, K., Wang, Q.

المصدر: IEEE Geoscience and Remote Sensing Letters IEEE Geosci. Remote Sensing Lett. Geoscience and Remote Sensing Letters, IEEE. 19:1-5 2022

المؤلفون: Yang Wu, Zhijie Zhang, Leida Chen, Shuye Zhang

المصدر: Journal of Materials Research and Technology, Vol 29, Iss , Pp 2868-2878 (2024)

مصطلحات موضوعية: Sn3.0Ag0·5Cu, Laser soldering, Interfacial reaction, Shear strength, Isothermal aging, Multiple reflowing, Mining engineering. Metallurgy, TN1-997

وصف الملف: electronic resource

Relation: http://www.sciencedirect.com/science/article/pii/S2238785424002734; https://doaj.org/toc/2238-7854

URL الوصول: https://doaj.org/article/801365787a74418dbc5f73c73a0625d9

المؤلفون: Liang, Peijie, Yan, Haidong, Li, Wangyun, Yang, Daoguo

المصدر: 2020 21st International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2020 21st International Conference on. :1-4 Aug, 2020

Relation: 2020 21st International Conference on Electronic Packaging Technology (ICEPT)

المؤلفون: Yan, Haidong, Ma, Weiyong, Mei, Yunhui, Yang, Daoguo

المصدر: 2018 19th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2018 19th International Conference on. :260-264 Aug, 2018

Relation: 2018 19th International Conference on Electronic Packaging Technology (ICEPT)

المؤلفون: Sabrina Patricia State (Rosoiu), Stefania Costovici, Marius Enachescu, Teodor Visan, Liana Anicai

المصدر: Materials, Vol 17, Iss 5, p 1034 (2024)

مصطلحات موضوعية: Sn-Cu-Ni ternary alloy, electrodeposition, reflowing process, anti-corrosive properties, Technology, Electrical engineering. Electronics. Nuclear engineering, TK1-9971, Engineering (General). Civil engineering (General), TA1-2040, Microscopy, QH201-278.5, Descriptive and experimental mechanics, QC120-168.85

وصف الملف: electronic resource

Relation: https://www.mdpi.com/1996-1944/17/5/1034; https://doaj.org/toc/1996-1944

URL الوصول: https://doaj.org/article/abbb0b01e7d44094a5330e8cb2d591fc

المؤلفون: JIA Ning, LIU Baofa, YUE Zhongxiang, SONG Yifeng, LI Jianzhong

المصدر: Cailiao Baohu, Vol 55, Iss 12, Pp 22-26 (2022)

مصطلحات موضوعية: salicylic acid, tin plate, reflowing, tin-iron alloy layer, Materials of engineering and construction. Mechanics of materials, TA401-492, Technology

وصف الملف: electronic resource

Relation: http://www.mat-pro.com/fileup/1001-1560/PDF/20221204.pdf; https://doaj.org/toc/1001-1560

URL الوصول: https://doaj.org/article/63719068c5104db6b4815a0027354e80

المؤلفون: Lin, Xiao-ling, Xie, Shao-feng, Yao, Ruo-he

المصدر: 2015 16th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2015 16th International Conference on. :1462-1466 Aug, 2015

Relation: 2015 16th International Conference on Electronic Packaging Technology (ICEPT)

المؤلفون: Zhu, Yandan, Wang, Lifeng, Liu, Yang, Lv, Ye

المصدر: 2012 7th International Forum on Strategic Technology (IFOST) Strategic Technology (IFOST), 2012 7th International Forum on. :1-4 Sep, 2012

Relation: 2012 7th International Forum on Strategic Technology (IFOST)

المؤلفون: Yin, Zuozhu^{Aff1, Aff2}, Lin, Mei, Li, Qi, Lv, Xiaochun

المصدر: Journal of Electronic Materials. 49(11):6721-6726