المؤلفون: Pham, Hong-Phuc^{Aff11, Aff12}, Le, Mai-Phuong^{Aff11, Aff12}, Tran, Le-Giang^{Aff11, Aff12}, Nguyen, Thanh-Qua^{Aff11, Aff12}

المساهمون: Magjarević, Ratko, Series Editor^Aff1, Ładyżyński, Piotr, Associate Editor^Aff2, Ibrahim, Fatimah, Associate Editor^Aff3, Lackovic, Igor, Associate Editor^Aff4, Rock, Emilio Sacristan, Associate Editor^Aff5, Vo, Van Toi, editor^Aff6, Nguyen, Thi-Hiep, editor^Aff7, Vong, Binh Long, editor^Aff8, Le, Ngoc Bich, editor^Aff9, Nguyen, Thanh Qua, editor^Aff10

المصدر: 9th International Conference on the Development of Biomedical Engineering in Vietnam : Proceedings of BME 9, 2022, Ho Chi Minh City, Vietnam: Translational Healthcare Technology from Advanced to Low and Middle-Income Countries in the Era of Covid and Digital Transformation. 95:573-582

المؤلفون: Feng, Zitao, Xiao, Zhiqing, Sun, Lexin, Yang, Yuqian, Guo, Weijin

المصدر: 2022 IEEE 35th International Conference on Micro Electro Mechanical Systems Conference (MEMS) Micro Electro Mechanical Systems Conference (MEMS), 2022 IEEE 35th International Conference on. :931-934 Jan, 2022

Relation: 2022 IEEE 35th International Conference on Micro Electro Mechanical Systems Conference (MEMS)

المؤلفون: Milivojevic, Nevena, Caballero, David, Carvalho, Mariana R, Kokanovic, Mihajlo, Zivanovic, Marko, Filipovic, Nenad, Reis, Rui L, Oliveira, Joaquim M

المصدر: 2021 IEEE 21st International Conference on Bioinformatics and Bioengineering (BIBE) Bioinformatics and Bioengineering (BIBE),2021 IEEE 21st International Conference on. :1-6 Oct, 2021

Relation: 2021 IEEE 21st International Conference on Bioinformatics and Bioengineering (BIBE)

المؤلفون: In Ho Cho, Myung Gi Ji, Jaeyoun Kim

المصدر: Micromachines, Vol 15, Iss 3, p 417 (2024)

مصطلحات موضوعية: triboelectricity, tribocharge, contact electrification, elastomer, replica molding, PDMS, Mechanical engineering and machinery, TJ1-1570

وصف الملف: electronic resource

Relation: https://www.mdpi.com/2072-666X/15/3/417; https://doaj.org/toc/2072-666X

URL الوصول: https://doaj.org/article/0cbd109e74fb45afb69c169896a8e620

المؤلفون: Wang, Mengjiao, Jun, Cai, Wang, Zhenhu

المصدر: 2018 IEEE 13th Annual International Conference on Nano/Micro Engineered and Molecular Systems (NEMS) Nano/Micro Engineered and Molecular Systems (NEMS), 2018 IEEE 13th Annual International Conference on. :436-439 Apr, 2018

Relation: 2018 IEEE 13th Annual International Conference on Nano/Micro Engineered and Molecular Systems (NEMS)

المؤلفون: Das, Anindita, Pant, Udit, Cao, Cuong^{Aff2, Aff3}, Moirangthem, Rakesh S.^{Aff1, IDs1227402247450_cor4}, Kamble, Hitesh Bhanudas

المصدر: Nano Research. 16(1):1132-1140

المؤلفون: Durva Naik, Gaurav Balakrishnan, Mahathy Rajagopalan, Xiaozili Huang, Nihar Trivedi, Arnav Bhat, Christopher J. Bettinger

المصدر: Advanced Science, Vol 10, Iss 30, Pp n/a-n/a (2023)

مصطلحات موضوعية: digital light processing (DLP) 3D printing, intestinal retention, mechanical interlocking, microstructures, replica molding, villi, Science

وصف الملف: electronic resource

Relation: https://doaj.org/toc/2198-3844

URL الوصول: https://doaj.org/article/c5c9ddd04f7b4270aa9573ff0ec863f3

المؤلفون: Kumar, G. D. V. Santhosh, Singh, Shiv Govind, Vanjari, Siva Rama Krishna

المصدر: 2016 3rd International Conference on Emerging Electronics (ICEE) Emerging Electronics (ICEE),2016 3rd International Conference on. :1-4 Dec, 2016

Relation: 2016 3rd International Conference on Emerging Electronics (ICEE)

المؤلفون: Arai, M., Miki, N.

المصدر: 2015 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) Electronics Packaging and iMAPS All Asia Conference (ICEP-IACC), 2015 International Conference on. :128-131 Apr, 2015

Relation: 2015 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC)

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