المؤلفون: Abdin, M.M., Johnson, W.J.D., Wang, J., Weller, T.M.

المصدر: IEEE Transactions on Microwave Theory and Techniques IEEE Trans. Microwave Theory Techn. Microwave Theory and Techniques, IEEE Transactions on. 69(12):5381-5392 Dec, 2021

المؤلفون: He, X., Tehrani, B.K., Bahr, R., Su, W., Tentzeris, M.M.

المصدر: IEEE Transactions on Microwave Theory and Techniques IEEE Trans. Microwave Theory Techn. Microwave Theory and Techniques, IEEE Transactions on. 68(7):2716-2724 Jul, 2020

المؤلفون: Chen, C., Lin, Y., Groth, A., Lai, Y., Lin, C., Chang, H., Chuang, T.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 10(6):1061-1068 Jun, 2020

المؤلفون: Zongjie, Han, Le, Jie, Wei, Yan, Yongfang, Hu, Xiaoxuan, Li

المصدر: 2018 19th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2018 19th International Conference on. :125-128 Aug, 2018

Relation: 2018 19th International Conference on Electronic Packaging Technology (ICEPT)

المؤلفون: Luechinger, C., Chen, R., Fu, J., Poncelet, B., Valentin, O., Walker, T.J., Xu, T.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 7(9):1567-1577 Sep, 2017

المؤلفون: Marenco, Norman, Kontek, Magdalena, Reinert, Wolfgang, Lingner, Jan, Poech, Max-Hermann

المصدر: 2013 Eurpoean Microelectronics Packaging Conference (EMPC) Microelectronics Packaging Conference (EMPC) , 2013 European. :1-4 Sep, 2013

Relation: 2013 European Microelectronics Packaging Conference (EMPC)

المؤلفون: Jianbiao Pan, Pafchek, R. M., Judd, F. F., Baxter, J. B.

المصدر: IEEE Transactions on Advanced Packaging IEEE Trans. Adv. Packag. Advanced Packaging, IEEE Transactions on. 29(4):707-713 Nov, 2006

المؤلفون: Chun-Hao CHEN, Jan HOEFER, Yen-Cheng LIN

المصدر: Sensors & Transducers, Vol 235, Iss 7, Pp 37-42 (2019)

مصطلحات موضوعية: ultrasonic bonding, ribbon bonding, cu/al clad ribbon, ag-alloy ribbon, power ic, Technology (General), T1-995

وصف الملف: electronic resource

Relation: https://sensorsportal.com/HTML/DIGEST/july_2019/Vol_235/P_3097.pdf; https://doaj.org/toc/2306-8515; https://doaj.org/toc/1726-5479

URL الوصول: https://doaj.org/article/c01ebb04b9c04aaab89d3c0e5345008f

المؤلفون: Won-Sang Shin, Dae-Won Cho, Donghyuck Jung, Heeshin Kang, Jeng O Kim, Yoon-Jun Kim, Changkyoo Park

المصدر: Metals, Vol 11, Iss 5, p 831 (2021)

مصطلحات موضوعية: laser welding, aluminum, copper, ribbon bonding, intermetallic compounds, Mining engineering. Metallurgy, TN1-997

وصف الملف: electronic resource

Relation: https://www.mdpi.com/2075-4701/11/5/831; https://doaj.org/toc/2075-4701

URL الوصول: https://doaj.org/article/2ea85d57298c45a085cf1583158e6283

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