المؤلفون: Sakib, A R Nazmus, Ricon, Ruther, Eom, Jake, Kawashima, Yoshitsugu, Azuma, Kosuke, Tharumalingam, Ganesh, Kim, Young

المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1108-1112 May, 2024

Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

المؤلفون: Chen, C., Suetake, A., Huo, F., Kim, D., Zhang, Z., Hsieh, M., Li, W., Wakasugi, N., Takeshita, K., Yamaguchi, Y., Momose, Y., Suganuma, K.

المصدر: IEEE Transactions on Power Electronics IEEE Trans. Power Electron. Power Electronics, IEEE Transactions on. 39(9):10638-10650 Sep, 2024

المؤلفون: Chen, Chuantong, Liu, Ran, Kobayashi, Koji, Osanai, Hideyo, Zhang, Zheng, Suganuma, Katsuaki

المصدر: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) Microelectronics and Packaging Conference & Exhibition (EMPC), 2023 24th European. :1-4 Sep, 2023

Relation: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)

المؤلفون: Surner, Lennard, Chen, Lili, Bendjus, Beatrice, Cikalova, Ulana, Muench, Stefan

المصدر: 2023 IEEE 14th International Symposium on Diagnostics for Electrical Machines, Power Electronics and Drives (SDEMPED) Diagnostics for Electrical Machines, Power Electronics and Drives (SDEMPED), 2023 IEEE 14th International Symposium on. :588-593 Aug, 2023

Relation: 2023 IEEE 14th International Symposium on Diagnostics for Electrical Machines, Power Electronics and Drives (SDEMPED)

المؤلفون: Steinberger, Fabian, Bhogaraju, Sri Krishna, Elger, Gordon

المصدر: 2023 IMAPS Nordic Conference on Microelectronics Packaging (NordPac) Microelectronics Packaging (NordPac), 2023 IMAPS Nordic Conference on. :1-5 Jun, 2023

Relation: 2023 IMAPS Nordic Conference on Microelectronics Packaging (NordPac)

المؤلفون: Rodrigues, Augusto, Roshanghias, Ali

المصدر: 2023 46th International Spring Seminar on Electronics Technology (ISSE) Electronics Technology (ISSE), 2023 46th International Spring Seminar on. :1-4 May, 2023

Relation: 2023 46th International Spring Seminar on Electronics Technology (ISSE)

المؤلفون: Chen, Chuantong, Liu, Yang, Li, Wangyun, Huo, Fupeng, Ueshima, Minoru, Sakamoto, Takehsi, Oda, Yukinori, Suganuma, Katsuaki

المصدر: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :651-655 May, 2023

Relation: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)

المؤلفون: Saini, Sapna, Kumar, Jitender^{Aff1, IDs1319802402305y_cor2}, Kadyan, M. S.

المصدر: International Journal of System Assurance Engineering and Management. 15(7):2931-2949

المؤلفون: Liu, Xiao, Wang, Lu^{Aff1, Aff2, IDs12666024033624_cor2}, Xue, Zheng-Liang^{Aff2, Aff3}

المصدر: Transactions of the Indian Institute of Metals. :1-10

المؤلفون: Xue, Yuxiao^{Aff1, IDs4083102400846x_cor1}, Zeng, Junjie, Zhu, Deqing^{Aff2, IDs4083102400846x_cor3}, Pan, Jian, Lv, Xuewei

المصدر: Journal of Sustainable Metallurgy. 10(2):982-991