يعرض 1 - 10 نتائج من 2,515 نتيجة بحث عن '"smd"', وقت الاستعلام: 1.52s تنقيح النتائج
  1. 1
    مؤتمر
    Influences on the Mechanical Strength of Inkjet-Printed, Ag-Nanoparticle-Based Interconnects of Fine-Pitch Components

    المؤلفون: Voigt, Christian, Dornheim, Johannes, Muth, Alexander, Petersen, Matthias, Thielen, Nils, Franke, Jorg

    المصدر: 2024 47th International Spring Seminar on Electronics Technology (ISSE) Electronics Technology (ISSE), 2024 47th International Spring Seminar on. 2024:1-6 May, 2024

    Relation: 2024 47th International Spring Seminar on Electronics Technology (ISSE)

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  2. 2
    مؤتمر
    LEDs Lifetime Prediction Modeling: Thermomechanical Simulation for SAC305 and SAC105

    المؤلفون: Akhtar, Mohd Zubair, Schmid, Maximilian, Zippelius, Andreas, Elger, Gordon

    المصدر: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024 25th International Conference on. :1-10 Apr, 2024

    Relation: 2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

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  3. 3
    مؤتمر
    Experiment Based Empirical Model for SMD Fuse under Pulsed Current Excitation

    المؤلفون: Tathode, Manish, Dam, Shimul Kumar, Baiju, P., John, Vinod

    المصدر: 2023 11th National Power Electronics Conference (NPEC) Power Electronics Conference (NPEC), 2023 11th National. :1-6 Dec, 2023

    Relation: 2023 11th National Power Electronics Conference (NPEC)

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  4. 4
    دورية أكاديمية
    A Method for Deembedding the Mounting Pad and Via-Hole Effect in a Test Fixture for Accurate Impedance Measurement of the Surface Mount Device Component

    المؤلفون: Lee, S., Kim, H., Ahn, J., Rhee, J., Cho, J., Ahn, S.

    المصدر: IEEE Transactions on Instrumentation and Measurement IEEE Trans. Instrum. Meas. Instrumentation and Measurement, IEEE Transactions on. 73:1-13 2024

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  5. 5
    مؤتمر
    Reliability Testing of Recycled SMD Components Reused in E-Textiles After Ageing by Washing Cycles

    المؤلفون: Hirman, Martin, Navratil, Jiri, Benesova, Andrea, Steiner, Frantisek

    المصدر: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) Microelectronics and Packaging Conference & Exhibition (EMPC), 2023 24th European. :1-5 Sep, 2023

    Relation: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)

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  6. 6
    مؤتمر
    EEMNet:An End-to-End Efficient Model for Electronic Fabrication Defect Detection

    المؤلفون: Liming, Zheng, Yuxiang, Wu

    المصدر: 2023 42nd Chinese Control Conference (CCC) Chinese Control Conference (CCC), 2023 42nd. :8362-8366 Jul, 2023

    Relation: 2023 42nd Chinese Control Conference (CCC)

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  7. 7
    مؤتمر
    A Novel Milling Method in Integrated Heat Spreader Detachment to Preserve Surface Mount Devices in High Performance Product

    المؤلفون: Goh, E., Azlan, M. Z., Chandra Mohan, S., Loh, S. C., Moo, Y. C., Chor, T. H.

    المصدر: 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2023 IEEE International Symposium on the. :1-5 Jul, 2023

    Relation: 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

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  8. 8
    مؤتمر
    Study on a High Voltage Divider composed of SMD components on PCBs for Power Quality Measurement

    المؤلفون: Dusdieker, Saskia, Kuhnke, Tobias, Jenau, Frank

    المصدر: 2023 3rd International Conference on Electrical, Computer, Communications and Mechatronics Engineering (ICECCME) Electrical, Computer, Communications and Mechatronics Engineering (ICECCME), 2023 3rd International Conference on. :1-5 Jul, 2023

    Relation: 2023 3rd International Conference on Electrical, Computer, Communications and Mechatronics Engineering (ICECCME)

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  9. 9
    مؤتمر
    Simulation and Verification of a 10 kV RC Divider Module composed of SMD components on PCBs for Power Quality Measurement

    المؤلفون: Dusdieker, Saskia, Kuhnke, Tobias, Razavifar, Mohammad, Jenau, Frank

    المصدر: 2023 IEEE Belgrade PowerTech PowerTech, 2023 IEEE. :01-06 Jun, 2023

    Relation: 2023 IEEE Belgrade PowerTech

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  10. 10
    مؤتمر
    IoT-Based Irrigation System For Agriculture 5.0

    المؤلفون: Pandrea, Vlad-Andrei, Ciocoiu, Andrei-Ovidiu, Machedon-Pisu, Mihai

    المصدر: 2023 17th International Conference on Engineering of Modern Electric Systems (EMES) Engineering of Modern Electric Systems (EMES), 2023 17th International Conference on. :1-4 Jun, 2023

    Relation: 2023 17th International Conference on Engineering of Modern Electric Systems (EMES)

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