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1دورية أكاديمية
المؤلفون: Ishtiaque K. Robin, Tim Gräning, Ying Yang, Yutai Katoh, Steven J. Zinkle
المصدر: Journal of Materials Research and Technology, Vol 30, Iss , Pp 3663-3674 (2024)
مصطلحات موضوعية: Fusion plasma facing materials, W-steel transition layer bond, SPS, Solid state diffusion bond, Diffusion kinetics, Mining engineering. Metallurgy, TN1-997
وصف الملف: electronic resource
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2دورية أكاديمية
المؤلفون: Rahul V. Tikale, Abhijeet R. Kadam, D.K. Halwar, S.J. Dhoble
المصدر: Materials Letters: X, Vol 21, Iss , Pp 100224- (2024)
مصطلحات موضوعية: WLEDs, Solid state diffusion, Red phosphor, XRD, SEM, Materials of engineering and construction. Mechanics of materials, TA401-492
وصف الملف: electronic resource
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3مؤتمر
المصدر: 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2018 IEEE 20th. :924-931 Dec, 2018
Relation: 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC)
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4دورية أكاديمية
المؤلفون: N. Alcantar-Mondragón, F. Reyes-Calderón, V. García-García, P. Garnica-González, S. Estrada-Hernández
المصدر: Results in Materials, Vol 20, Iss , Pp 100489- (2023)
مصطلحات موضوعية: MSS, SAW, FEM, Solid-state-diffusion, Delta ferrite, Corrosion resistance, Materials of engineering and construction. Mechanics of materials, TA401-492
وصف الملف: electronic resource
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5كتاب إلكتروني
المؤلفون: Zhang, LinjingAff39, Zhai, KefanAff39, Cai, XueAff39, Zhang, CaipingAff39, Zhang, WeigeAff39
المساهمون: Angrisani, Leopoldo, Series EditorAff1, Arteaga, Marco, Series EditorAff2, Chakraborty, Samarjit, Series EditorAff3, Chen, Jiming, Series EditorAff4, Chen, Shanben, Series EditorAff5, Chen, Tan Kay, Series EditorAff6, Dillmann, Rüdiger, Series EditorAff7, Duan, Haibin, Series EditorAff8, Ferrari, Gianluigi, Series EditorAff9, Ferre, Manuel, Series EditorAff10, Jabbari, Faryar, Series EditorAff11, Jia, Limin, Series EditorAff12, Kacprzyk, Janusz, Series EditorAff13, Khamis, Alaa, Series EditorAff14, Kroeger, Torsten, Series EditorAff15, Li, Yong, Series EditorAff16, Liang, Qilian, Series EditorAff17, Martín, Ferran, Series EditorAff18, Ming, Tan Cher, Series EditorAff19, Minker, Wolfgang, Series EditorAff20, Misra, Pradeep, Series EditorAff21, Mukhopadhyay, Subhas, Series EditorAff22, Ning, Cun-Zheng, Series EditorAff23, Nishida, Toyoaki, Series EditorAff24, Oneto, Luca, Series EditorAff25, Panigrahi, Bijaya Ketan, Series EditorAff26, Pascucci, Federica, Series EditorAff27, Qin, Yong, Series EditorAff28, Seng, Gan Woon, Series EditorAff29, Speidel, Joachim, Series EditorAff30, Veiga, Germano, Series EditorAff31, Wu, Haitao, Series EditorAff32, Zamboni, Walter, Series EditorAff33, Zhang, Junjie James, Series EditorAff34, Sun, Fengchun, editorAff35, Yang, Qingxin, editorAff36, Dahlquist, Erik, editorAff37, Xiong, Rui, editorAff38
المصدر: The Proceedings of the 5th International Conference on Energy Storage and Intelligent Vehicles (ICEIV 2022). 1016:1137-1150
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6دورية أكاديمية
المؤلفون: Tokushige, ManabuAff1, IDs10008022052801_cor1
المصدر: Journal of Solid State Electrochemistry: Current Research and Development in Science and Technology. 26(12):2781-2790
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7مؤتمر
المؤلفون: Cai, Jian, Wang, Junqiang, Wang, Qian, Wu, Zijian, Wang, Dejun
المصدر: 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2017 IEEE 67th. :1742-1747 May, 2017
Relation: 2017 IEEE 67th Electronic Components and Technology Conference (ECTC)
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8دورية أكاديمية
المؤلفون: A Degnah, H F Alnaser, A Kurdi, M A Al-Gawati, N A Madkhali, N Haneklaus, A Alhazaa
المصدر: Materials Research Express, Vol 11, Iss 7, p 076518 (2024)
مصطلحات موضوعية: CALPHAD approach, solid-state diffusion bonding, field-assisted sintering technology, INCONEl 617, faying surface, thermomechanical affected zone, Materials of engineering and construction. Mechanics of materials, TA401-492, Chemical technology, TP1-1185
وصف الملف: electronic resource
Relation: https://doaj.org/toc/2053-1591
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9دورية أكاديمية
المؤلفون: Wenchao Wang, Ziyu Liu, Delong Qiu, Zhiyuan Zhu, Na Yan, Shijin Ding, David Wei Zhang
المصدر: Micromachines, Vol 14, Iss 12, p 2242 (2023)
مصطلحات موضوعية: flip chip, Au-Sn, solid-state diffusion (SSD), thermal gradient bonding (TGB), intermetallic compound (IMC), Mechanical engineering and machinery, TJ1-1570
وصف الملف: electronic resource
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10دورية أكاديمية
المؤلفون: Chen Chen, Yanni Zhu, Kainan Dou, Chuang Liu, Chao Yu, Sihang Ji, Jin Wang
المصدر: Micromachines, Vol 14, Iss 11, p 2084 (2023)
مصطلحات موضوعية: light-emitting devices, in situ dynamic thermal crystallization, solid-state diffusion, Mechanical engineering and machinery, TJ1-1570
وصف الملف: electronic resource