المؤلفون: Cai, Jian, Wang, Junqiang, Wang, Qian, Wu, Zijian, Wang, Dejun

المصدر: 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2017 IEEE 67th. :1742-1747 May, 2017

Relation: 2017 IEEE 67th Electronic Components and Technology Conference (ECTC)

المؤلفون: Wenchao Wang, Ziyu Liu, Delong Qiu, Zhiyuan Zhu, Na Yan, Shijin Ding, David Wei Zhang

المصدر: Micromachines, Vol 14, Iss 12, p 2242 (2023)

مصطلحات موضوعية: flip chip, Au-Sn, solid-state diffusion (SSD), thermal gradient bonding (TGB), intermetallic compound (IMC), Mechanical engineering and machinery, TJ1-1570

وصف الملف: electronic resource

Relation: https://www.mdpi.com/2072-666X/14/12/2242; https://doaj.org/toc/2072-666X

URL الوصول: https://doaj.org/article/43d5fbb9f06642ecb1ca9a25d8a15b09

المؤلفون: Wang, Junqiang, Wang, Qian, Wang, Dejun, Cai, Jian

المصدر: 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2016 IEEE 66th. :1765-1771 May, 2016

Relation: 2016 IEEE 66th Electronic Components and Technology Conference (ECTC)

المؤلفون: Wang, J., Wang, Q., Wu, Z., Wang, D., Cai, J.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 7(1):19-26 Jan, 2017

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