المؤلفون: Pun, Kelvin P. L., Rotanson, Jason, Dhaka, Navdeep S., Cheung, Chee-Wah, Chan, Alan H. S.

المصدر: 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2018 IEEE 20th. :924-931 Dec, 2018

Relation: 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC)

المؤلفون: A Degnah, H F Alnaser, A Kurdi, M A Al-Gawati, N A Madkhali, N Haneklaus, A Alhazaa

المصدر: Materials Research Express, Vol 11, Iss 7, p 076518 (2024)

مصطلحات موضوعية: CALPHAD approach, solid-state diffusion bonding, field-assisted sintering technology, INCONEl 617, faying surface, thermomechanical affected zone, Materials of engineering and construction. Mechanics of materials, TA401-492, Chemical technology, TP1-1185

وصف الملف: electronic resource

Relation: https://doaj.org/toc/2053-1591

URL الوصول: https://doaj.org/article/1558f4d118b5429d9350867cee8865c3

المؤلفون: Cai, Jian, Wang, Junqiang, Wang, Qian, Liu, Ziyu, Wang, Dejun, Seo, Sun-Kyoung, Cho, Tae-Je

المصدر: 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC) , 2015 IEEE 65th. :1616-1623 May, 2015

Relation: 2015 IEEE 65th Electronic Components and Technology Conference (ECTC)

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المؤلفون: Balabanov, S.S., Firsov, K.N., Gavrishchuk, E.M., Ikonnikov, V.B., Kazantsev, S.Yu., Kononov, I.G., Kotereva, T.V., Savin, D.V., Timofeeva, N.A., Voronin, P.G.

المصدر: 2018 International Conference Laser Optics (ICLO) Laser Optics (ICLO), 2018 International Conference. :111-111 Jun, 2018

Relation: 2018 International Conference Laser Optics (ICLO)

المؤلفون: Michael Ben-Haroush, Brigit Mittelman, Roni Shneck, Elad Priel

المصدر: Materials, Vol 16, Iss 2, p 769 (2023)

مصطلحات موضوعية: solid-state diffusion bonding, bonding strength, Al alloys, oxide film, FE, Technology, Electrical engineering. Electronics. Nuclear engineering, TK1-9971, Engineering (General). Civil engineering (General), TA1-2040, Microscopy, QH201-278.5, Descriptive and experimental mechanics, QC120-168.85

وصف الملف: electronic resource

Relation: https://www.mdpi.com/1996-1944/16/2/769; https://doaj.org/toc/1996-1944

URL الوصول: https://doaj.org/article/7852d302048849b9aa1388bb27a6da5d

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المؤلفون: Akira Hasegawa, Shuhei Nogami, Kohei Otomo, Michitoshi Toyota, Hiroyuki Noto, Takaya Hattori

المصدر: Shuhei Nogami, Hiroyuki Noto, Michitoshi Toyota, Takaya Hattori, Kohei Otomo, Akira Hasegawa, Solid state diffusion bonding of doped tungsten alloys with different thermo-mechanical properties, Fusion Engineering and Design, Volume 136, Part A, 2018, Pages 76-81, ISSN 0920-3796, https://doi.org/10.1016/j.fusengdes.2017.12.036.

مصطلحات موضوعية: 010302 applied physics, Materials science, Mechanical Engineering, Doping, Recrystallization (metallurgy), chemistry.chemical_element, Tungsten, Thermal diffusivity, 01 natural sciences, 010305 fluids & plasmas, Atomic diffusion, Nuclear Energy and Engineering, chemistry, Solid state diffusion bonding Tungsten Potassium doping Rhenium addition Thermal diffusivity Tensile strength, 0103 physical sciences, Ultimate tensile strength, General Materials Science, Composite material, Diffusion bonding, Thermo mechanical, Civil and Structural Engineering

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::bfda98533aaac5d34cd23b4b9133148b
http://hdl.handle.net/10655/00013031