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1مؤتمر
المؤلفون: Wu, Peixin, Yang, Xin, Liu, Guoyou, Wu, Xinlong, Wang, Yuesong
المصدر: 2024 IEEE 10th International Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia) Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia), 2024 IEEE 10th International. :4767-4771 May, 2024
Relation: 2024 IEEE 10th International Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia)
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2مؤتمر
المؤلفون: Ji, YiChao, Wang, JiaNing, Zhang, DongLei, Wei, ZhaoYang
المصدر: 2024 IEEE 10th International Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia) Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia), 2024 IEEE 10th International. :5018-5024 May, 2024
Relation: 2024 IEEE 10th International Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia)
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3دورية أكاديمية
المصدر: IEEE Transactions on Medical Imaging IEEE Trans. Med. Imaging Medical Imaging, IEEE Transactions on. 43(5):1895-1909 May, 2024
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4مؤتمر
المؤلفون: Shao, Hongming, Zhang, Sujuan, Wan, Bo, Wang, Ye, Long, Mengxiang
المصدر: 2023 Global Reliability and Prognostics and Health Management Conference (PHM-Hangzhou) Reliability and Prognostics and Health Management Conference (PHM-Hangzhou), 2023 Global. :1-6 Oct, 2023
Relation: 2023 Global Reliability and Prognostics and Health Management Conference (PHM-Hangzhou)
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5دورية أكاديمية
المؤلفون: Zhao, XiaoyuAff1, Aff2, Chen, KeweiAff3, Aff4, Aff5, IDs11571023099413_cor2, Wang, Hailing, Gao, Yufei, Ji, Xiangmin, Li, Yanping
المصدر: Cognitive Neurodynamics. 18(3):813-827
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6مؤتمر
المؤلفون: Hara, Tomoaki, Fukunaga, Shuhei, Funaki, Tsuyoshi
المصدر: 2024 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2024 International Conference on. :233-234 Apr, 2024
Relation: 2024 International Conference on Electronics Packaging (ICEP)
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7مؤتمر
المؤلفون: Badalawa, Wasanthamala, Hara, Tomoaki
المصدر: 2024 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2024 International Conference on. :239-240 Apr, 2024
Relation: 2024 International Conference on Electronics Packaging (ICEP)
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8مؤتمر
المؤلفون: Guo, Dalu, Zhang, Ke, Li, Jiaxing, Kong, Youyong
المصدر: ICASSP 2023 - 2023 IEEE International Conference on Acoustics, Speech and Signal Processing (ICASSP) Acoustics, Speech and Signal Processing (ICASSP), ICASSP 2023 - 2023 IEEE International Conference on. :1-5 Jun, 2023
Relation: ICASSP 2023 - 2023 IEEE International Conference on Acoustics, Speech and Signal Processing (ICASSP)
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9مؤتمر
المصدر: ICASSP 2023 - 2023 IEEE International Conference on Acoustics, Speech and Signal Processing (ICASSP) Acoustics, Speech and Signal Processing (ICASSP), ICASSP 2023 - 2023 IEEE International Conference on. :1-5 Jun, 2023
Relation: ICASSP 2023 - 2023 IEEE International Conference on Acoustics, Speech and Signal Processing (ICASSP)
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10دورية أكاديمية
المؤلفون: Zhou, Minhao, Theologis, Alekos, OConnell, Grace
المصدر: JOR Spine. 7(1)
مصطلحات موضوعية: biomechanics, injury, structure–function relationships
وصف الملف: application/pdf
URL الوصول: https://escholarship.org/uc/item/085294qv