يعرض 1 - 10 نتائج من 120 نتيجة بحث عن '"sub-modeling"', وقت الاستعلام: 0.84s تنقيح النتائج
  1. 1
    دورية أكاديمية

    المصدر: IEEE Journal of the Electron Devices Society IEEE J. Electron Devices Soc. Electron Devices Society, IEEE Journal of the. 10:169-179 2022

  2. 2
    مؤتمر

    المصدر: ICASSP 2021 - 2021 IEEE International Conference on Acoustics, Speech and Signal Processing (ICASSP) Acoustics, Speech and Signal Processing (ICASSP), ICASSP 2021 - 2021 IEEE International Conference on. :6029-6033 Jun, 2021

    Relation: ICASSP 2021 - 2021 IEEE International Conference on Acoustics, Speech and Signal Processing (ICASSP)

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  4. 4
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  6. 6
    مؤتمر

    المصدر: 2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM) Thermal Measurement, Modeling & Management Symposium (SEMI-THERM), 2017 33rd. :57-62 2017

    Relation: 2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM)

  7. 7
    مؤتمر

    المصدر: 2018 IEEE International Interconnect Technology Conference (IITC) Interconnect Technology Conference (IITC), 2018 IEEE International. :88-90 Jun, 2018

    Relation: 2018 IEEE International Interconnect Technology Conference (IITC)

  8. 8
    مؤتمر

    المؤلفون: Yang, Chen, Wang, Jun, Lin, Lin

    المصدر: 2015 16th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2015 16th International Conference on. :826-829 Aug, 2015

    Relation: 2015 16th International Conference on Electronic Packaging Technology (ICEPT)

  9. 9
    دورية أكاديمية

    لا يتم عرض هذه النتيجة على الضيوف.

  10. 10
    دورية أكاديمية

    لا يتم عرض هذه النتيجة على الضيوف.