المؤلفون: Ding, Yue^{Aff1, IDs1143102325887_cor1}, Li, Cheng-Ya, Niu, XinRui, Wang, Gang-Feng^{Aff1, IDs1143102325887_cor4}

المصدر: Science China Technological Sciences. 67(6):1757-1764

المؤلفون: Mohanram, Hariram, Kim, Yiram, Ni, Geng, Kim, Choong-Un, Ankamah-Kusi, Sylvester, Chen, Qiao, Thompson, Patrick

المصدر: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :1060-1065 May, 2023

Relation: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)

المؤلفون: Draghiciu, L., Tudose, I.V., Romanitan, C., Gavrila, R., Brincoveanu, O.A., Comanescu, F.C., Pachiu, C., Muller, R., Dinescu, A., Koudoumas, E., Suchea, M.P.

المصدر: 2022 International Semiconductor Conference (CAS) Semiconductor Conference (CAS), 2022 International. :235-238 Oct, 2022

Relation: 2022 International Semiconductor Conference (CAS)

المؤلفون: Huang, Yu Lung, Huang, Joe, Huang, C. M., Yu, Kuo Haw, Luo, Tank, Hong, Wilson, Ren, Taishin

المصدر: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2021 IEEE 71st. :619-624 Jun, 2021

Relation: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC)

المؤلفون: A.S. Bhattacharyya

المصدر: Chemical Physics Impact, Vol 8, Iss , Pp 100551- (2024)

مصطلحات موضوعية: CNx, g-C3N4, Nanoindentation, Low hardness, Substrate effect, Physics, QC1-999, Chemistry, QD1-999

وصف الملف: electronic resource

Relation: http://www.sciencedirect.com/science/article/pii/S2667022424000951; https://doaj.org/toc/2667-0224

URL الوصول: https://doaj.org/article/0ef39aa5bff34f628d4b322fef24b658

المؤلفون: Lassnig, Alice, Zak, Stanislav

المصدر: Journal of Materials Research. 38(13)

مصطلحات موضوعية: Amorphous CuZr, Elastic properties, Nano-indentation, Nanocrystalline Cu, Substrate effect, Thin film

وصف الملف: application/pdf

URL الوصول: https://escholarship.org/uc/item/4s68153v
https://escholarship.org/content/qt4s68153v/qt4s68153v.pdf

المؤلفون: Timoumi, A.^{Aff1, IDs1090402302781y_cor1}, Altalhi, R., Alsalmi, O. H., Alamri, S. N., Ahmed, Saleh A.^{Aff3, Aff4, IDs1090402302781y_cor5}

المصدر: Journal of Inorganic and Organometallic Polymers and Materials. 33(11):3583-3594

المؤلفون: Wei, Jin, Zhang, Meng, Lyu, Gang, Chen, Kevin J.

المصدر: 2020 IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia) Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia), 2020 IEEE Workshop on. :1-4 Sep, 2020

Relation: 2020 IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia)

المؤلفون: Zhang, X., Liu, F., Li, B., Luo, J., Han, Z., Arsalan, M., Wan, J., Cristoloveanu, S.

المصدر: 2020 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS) Ultimate Integration on Silicon (EUROSOI-ULIS), 2020 Joint International EUROSOI Workshop and International Conference on. :1-4 Sep, 2020

Relation: 2020 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS)

المؤلفون: Vanbrabant, Martin, Nyssens, Lucas, Kilchytska, Valeriya, Raskin, Jean-Pierre

المصدر: 2021 IEEE Latin America Electron Devices Conference (LAEDC) Electron Devices Conference (LAEDC), 2021 IEEE Latin America. :1-3 Apr, 2021

Relation: 2021 IEEE Latin America Electron Devices Conference (LAEDC)