يعرض 1 - 10 نتائج من 1,865 نتيجة بحث عن '"subsurface damage"', وقت الاستعلام: 1.89s تنقيح النتائج
  1. 1
    دورية أكاديمية
    Revealing Subsurface Damage Morphology and Patterns in areal Ultrashort Pulse Laser Machining of Glass

    المؤلفون: Frank, SamsonAff1, IDs40516024002629_cor1, Reichenbächer, Maria, Seiler, Michael, Thelemann, Dennis, Arnold, ThomasAff3, Aff4, Bliedtner, Jens

    المصدر: Lasers in Manufacturing and Materials Processing. 11(3):631-648

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  2. 2
    دورية أكاديمية
    Analytical prediction of subsurface damage depth of monocrystalline silicon in ultrasonic vibration assisted wire sawing

    المؤلفون: Wang, YanAff1, IDs00170024138468_cor1, Bai, Tianqi, Shu, Li, Su, Jinhuan, Xu, Kangwei

    المصدر: The International Journal of Advanced Manufacturing Technology. 133(5-6):2445-2460

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  3. 3
    دورية أكاديمية
    High-speed drilling mechanism study of unidirectional CoCrFeNiAl fiber-reinforced aluminum matrix composites

    المؤلفون: Zhang, PingAff1, Aff2, IDs00170024137498_cor1, Wang, Shunxiang, Zhang, Jinlong, Sun, Yajie, Zhou, Hanping, Yue, XiujieAff2, Aff3

    المصدر: The International Journal of Advanced Manufacturing Technology. 133(1-2):451-466

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  4. 4
    دورية أكاديمية
    Surface evolution and subsurface damage mechanism in fixed abrasive lapping of Silicon carbide

    المؤلفون: Cao, Zhong-ChenAff1, Aff2, IDs0017002413604w_cor1, Zhang, Yang, Wang, Zhu

    المصدر: The International Journal of Advanced Manufacturing Technology. 132(9-10):4525-4540

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  5. 5
    دورية أكاديمية
    Surface Integrity of Binderless WC Using Dry Electrical Discharge Assisted Grinding

    المؤلفون: Lu, Yanjun, Mou, Xingyu, Xiao, HuapanAff2, IDs4068402400630y_cor3, Li, Kangsen, Wang, ChunjinAff2, IDs4068402400630y_cor5

    المصدر: International Journal of Precision Engineering and Manufacturing-Green Technology. :1-18

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  6. 6
    مؤتمر
    Theoretical Modelling of Subsurface Damage in Ultra-Precision Grinding of Fused Silica

    المؤلفون: Zhang, Fan, Xiao, Huapan, Cheung, Chi Fai, Wang, Chunjin

    المصدر: 2022 8th International Conference on Nanomanufacturing & 4th AET Symposium on ACSM and Digital Manufacturing (Nanoman-AETS) Nanomanufacturing & 4th AET Symposium on ACSM and Digital Manufacturing (Nanoman-AETS), 2022 8th International Conference on. :1-5 Aug, 2022

    Relation: 2022 8th International Conference on Nanomanufacturing & 4th AET Symposium on ACSM and Digital Manufacturing (Nanoman-AETS)

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  7. 7
    كتاب إلكتروني
    Deep Learning for Image Segmentation and Subsurface Damage Detection Based on Full-Field Surface Strains

    المؤلفون: Pal, AshishAff6, Meng, WeiAff6, Nagarajaiah, SatishAff7, Aff8, Aff9

    المساهمون: Zimmerman, Kristin B., Series EditorAff1, Platz, Roland, editorAff2, Flynn, Garrison, editorAff3, Neal, Kyle, editorAff4, Ouellette, Scott, editorAff5

    المصدر: Model Validation and Uncertainty Quantification, Volume 3 : Proceedings of the 41st IMAC, A Conference and Exposition on Structural Dynamics 2023. :127-132

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  8. 8
    دورية أكاديمية
    Study on the grindability and removal mechanism of high volume fraction SiCp/Al composites based on single diamond grain grinding

    المؤلفون: Yin, GuoqiangAff1, IDs4345202401028y_cor1, Liang, Hongrui, Wang, Dong, Liu, Zeyu, Zhou, Yunguang

    المصدر: Archives of Civil and Mechanical Engineering. 24(4)

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  9. 9
    دورية أكاديمية
    Study on grinding removal mechanism and subsurface damage of bionic layered graphene ceramic matrix composites

    المؤلفون: Zhou, YunguangAff1, IDs00170023128977_cor1, Zou, Ji, Zhang, Chunxue, Li, Dezhen, Ma, Lianjie, Li, Ming

    المصدر: The International Journal of Advanced Manufacturing Technology. 130(7-8):3837-3849

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  10. 10
    مؤتمر
    Overview of Subsurface Damage Detection Technologies for Ultra-smooth Quartz Components

    المؤلفون: Zhao, Dongfang, Cui, Junning, Bian, Xingyuan

    المصدر: 2021 IEEE 15th International Conference on Electronic Measurement & Instruments (ICEMI) Electronic Measurement & Instruments (ICEMI), 2021 IEEE 15th International Conference on. :364-369 Oct, 2021

    Relation: 2021 IEEE 15th International Conference on Electronic Measurement & Instruments (ICEMI)

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