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1مؤتمر
المؤلفون: Saito, Yoshio
المصدر: 2023 30th International Symposium on Discharges and Electrical Insulation in Vacuum (ISDEIV) Discharges and Electrical Insulation in Vacuum (ISDEIV), 2023 30th International Symposium on. :492-497 Jun, 2023
Relation: 2023 30th International Symposium on Discharges and Electrical Insulation in Vacuum (ISDEIV)
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2دورية أكاديمية
المؤلفون: Potemkin, G. V.Aff1, IDS2075113324700102_cor1, Ligachev, A. E.Aff2, IDS2075113324700102_cor2, Zhidkov, M. V.Aff3, IDS2075113324700102_cor3
المصدر: Inorganic Materials: Applied Research. 15(3):686-695
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3دورية أكاديمية
المؤلفون: Slobodyan, M. S.Aff1, IDs11182024031585_cor1, Markov, A. B.
المصدر: Russian Physics Journal. 67(5):565-615
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4دورية أكاديمية
المؤلفون: Guoliang Zuo, Yu Bai, Shuyan Shi, Zhanqiu Tan, Wenxue Fan, Zhiqiang Li, Hai Hao
المصدر: Journal of Materials Research and Technology, Vol 31, Iss , Pp 3332-3348 (2024)
مصطلحات موضوعية: Carbon nanotubes, Aluminum matrix composites, Surface processing marks, Solid-state bonding, Interface healing, Mining engineering. Metallurgy, TN1-997
وصف الملف: electronic resource
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5مؤتمر
المؤلفون: Costa-Greger, Justin, Pettit, Logan, Reicks, Andrew, Sarin, Suchit, Pettit, Chase, Shield, Jeffrey, Zuhlke, Craig, Gogos, George
المصدر: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2022 21st IEEE Intersociety Conference on. :1-8 May, 2022
Relation: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)
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6كتاب إلكتروني
المؤلفون: Wan, BoyangAff2, Man, ZiyanAff2, Chang, LiAff2
المساهمون: Gürgen, Selim, editorAff1
المصدر: Smart Systems with Shear Thickening Fluid. :71-86
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7كتاب إلكتروني
المؤلفون: Lesyk, DmytroAff15, Aff16, Aff18, Mordyuk, BohdanAff16, Martinez, SilviaAff17, Dzhemelinskyi, VitaliyAff15, Lamikiz, AitzolAff17
المساهمون: Chaari, Fakher, Series EditorAff1, Gherardini, Francesco, Series EditorAff2, Ivanov, Vitalii, Series EditorAff3, Aff11, Haddar, Mohamed, Series EditorAff4, Cavas-Martínez, Francisco, Editorial Board MemberAff5, di Mare, Francesca, Editorial Board MemberAff6, Kwon, Young W., Editorial Board MemberAff7, Trojanowska, Justyna, Editorial Board MemberAff8, Aff12, Xu, Jinyang, Editorial Board MemberAff9, Tonkonogyi, Volodymyr, editorAff10, Oborskyi, Gennadii, editorAff13, Pavlenko, Ivan, editorAff14
المصدر: Advanced Manufacturing Processes V : Selected Papers from the 5th Grabchenko’s International Conference on Advanced Manufacturing Processes (InterPartner-2023), September 5-8, 2023, Odessa, Ukraine. :296-306
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8مؤتمر
المؤلفون: Liu, Xiong, Wang, Qian, Li, Siquan, Wang, Siqi, Yin, Hua, Zhou, Mao, Zhou, Mengge
المصدر: 2020 IEEE International Conference on High Voltage Engineering and Application (ICHVE) High Voltage Engineering and Application (ICHVE), 2020 IEEE International Conference on. :1-4 Sep, 2020
Relation: 2020 IEEE International Conference on High Voltage Engineering and Application (ICHVE)
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9دورية أكاديمية
المؤلفون: Yazhou Hu, Xianrui Zou, Ning Liu, Tai Yang, Chaoqun Xia, Hongshui Wang, Chunyong Liang
المصدر: Journal of Materials Research and Technology, Vol 27, Iss , Pp 2684-2694 (2023)
مصطلحات موضوعية: Femtosecond laser surface processing, Surface modification, Titanium dioxide, Molecular dynamics simulation, Mining engineering. Metallurgy, TN1-997
وصف الملف: electronic resource
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10دورية أكاديمية
المؤلفون: Taylor, D.P., Kaigala, G.V.
المصدر: IEEE Transactions on Biomedical Engineering IEEE Trans. Biomed. Eng. Biomedical Engineering, IEEE Transactions on. 66(9):2491-2498 Sep, 2019