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1دورية أكاديمية
المصدر: IEEE Transactions on Circuits and Systems II: Express Briefs IEEE Trans. Circuits Syst. II Circuits and Systems II: Express Briefs, IEEE Transactions on. 71(4):2334-2338 Apr, 2024
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2دورية أكاديمية
المؤلفون: Farina, S., Labanca, I., Acconcia, G., Rech, I.
المصدر: IEEE Journal of Selected Topics in Quantum Electronics IEEE J. Select. Topics Quantum Electron. Selected Topics in Quantum Electronics, IEEE Journal of. 30(1: Single-Photon Technologies and Applications):1-11 Jan, 2024
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3دورية أكاديمية
المؤلفون: Imran, Mohammad, Chackrabarti, SantoshAff1, IDs4357802401357x_cor2, Khanuja, Manika, Hafiz, Aurangzeb Khurram
المصدر: Journal of Materials Research. 39(13):1963-1975
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4مؤتمر
المؤلفون: Talala, Tuomo, Nissinen, Ilkka
المصدر: 2023 IEEE International Instrumentation and Measurement Technology Conference (I2MTC) Instrumentation and Measurement Technology Conference (I2MTC), 2023 IEEE International. :1-6 May, 2023
Relation: 2023 IEEE International Instrumentation and Measurement Technology Conference (I2MTC)
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5مؤتمر
المؤلفون: Kekkonen, Jere, Talala, Tuomo, Nissinen, Ilkka
المصدر: 2023 IEEE International Instrumentation and Measurement Technology Conference (I2MTC) Instrumentation and Measurement Technology Conference (I2MTC), 2023 IEEE International. :1-6 May, 2023
Relation: 2023 IEEE International Instrumentation and Measurement Technology Conference (I2MTC)
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6دورية أكاديمية
المؤلفون: Talala, T., Kaikkonen, V.A., Virta, E., Makynen, A.J., Nissinen, I.
المصدر: IEEE Photonics Technology Letters IEEE Photon. Technol. Lett. Photonics Technology Letters, IEEE. 35(11):629-632 Jun, 2023
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7دورية أكاديمية
المؤلفون: Talala, T., Parkkinen, E., Nissinen, I.
المصدر: IEEE Journal of Solid-State Circuits IEEE J. Solid-State Circuits Solid-State Circuits, IEEE Journal of. 58(5):1350-1361 May, 2023
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8دورية أكاديمية
المؤلفون: Acconcia, G., Malanga, F., Farina, S., Ghioni, M., Rech, I.
المصدر: IEEE Transactions on Instrumentation and Measurement IEEE Trans. Instrum. Meas. Instrumentation and Measurement, IEEE Transactions on. 72:1-11 2023
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9دورية أكاديمية
المؤلفون: Amin, B.M., Kekkonen, J., Talala, T., Nissinen, I.
المصدر: IEEE Transactions on Instrumentation and Measurement IEEE Trans. Instrum. Meas. Instrumentation and Measurement, IEEE Transactions on. 72:1-10 2023
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10مؤتمر
المصدر: 2022 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2022 Symposium on. :1-4 Jul, 2022
Relation: 2022 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP)
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