المؤلفون: Huang, Jing^{Aff1, Aff2, Aff3}, Yan, Jingbo^{Aff1, IDs42247024007582_cor2}, Lei, Dejiang^{Aff2, IDs42247024007582_cor3}, Yi, Dawei^{Aff3, IDs42247024007582_cor4}, Zhu, Xiaoyang, Zhou, Jiangbo, He, Yihang^{Aff1, Aff3}, Li, Pei, Huang, Linhao, Liu, Dongxu

المصدر: Emergent Materials. :1-18

المؤلفون: Jat, Vinod Kumar, Patil, R. U.^{Aff1, IDs11665024097534_cor2}, Samant, Sanjay Singh

المصدر: Journal of Materials Engineering and Performance. :1-17

المؤلفون: Zani, Giulio^Aff10, Comi, Claudia^Aff10

المساهمون: di Prisco, Marco, Series Editor^{Aff1, Aff8}, Chen, Sheng-Hong, Series Editor^Aff2, Vayas, Ioannis, Series Editor^Aff3, Kumar Shukla, Sanjay, Series Editor^Aff4, Sharma, Anuj, Series Editor^Aff5, Kumar, Nagesh, Series Editor^Aff6, Wang, Chien Ming, Series Editor^Aff7, Menegotto, Marco, editor^Aff9

المصدر: Proceedings of Italian Concrete Conference 2020/21. 351:368-383

المؤلفون: Kumar, Ashish^{Aff1, IDs12633023026279_cor1}, Rana, R. S., Purohit, Rajesh, Baghel, Madhusudan, Namdev, Anurag, Kumar, Rajan

المصدر: Silicon. 15(18):7903-7915

المؤلفون: Sofiane Guessasma, Sofiane Belhabib

المصدر: Materials, Vol 17, Iss 11, p 2699 (2024)

مصطلحات موضوعية: crack propagation, additive manufacturing, material extrusion, microstructure, finite element computation, tensile behaviour, Technology, Electrical engineering. Electronics. Nuclear engineering, TK1-9971, Engineering (General). Civil engineering (General), TA1-2040, Microscopy, QH201-278.5, Descriptive and experimental mechanics, QC120-168.85

وصف الملف: electronic resource

Relation: https://www.mdpi.com/1996-1944/17/11/2699; https://doaj.org/toc/1996-1944

URL الوصول: https://doaj.org/article/ffa8125d268447fd96ad8ec7edb19a83

المؤلفون: Lei Li, Zhongmin Chen, Weixian Che, Cheng Cheng, Yiwu Chen, Dehui Li, Lianghua Liu, Yongchang Guo

المصدر: Buildings, Vol 14, Iss 4, p 1088 (2024)

مصطلحات موضوعية: waste crumb rubber, tensile behaviour, tensile constitutive model, flexural behaviour, ultra-high performance, Building construction, TH1-9745

وصف الملف: electronic resource

Relation: https://www.mdpi.com/2075-5309/14/4/1088; https://doaj.org/toc/2075-5309

URL الوصول: https://doaj.org/article/95bba0fe03db4114a4d3f5d481f7ccb4

المؤلفون: S.G. Wang, S.Y. Liu, M. Sun, B.H. Tian, Z.D. Zhang

المصدر: Journal of Materials Research and Technology, Vol 23, Iss , Pp 331-347 (2023)

مصطلحات موضوعية: Tensile behaviour, Martensitic transformation, Void, Surface roughness, Micro-hardness, Mining engineering. Metallurgy, TN1-997

وصف الملف: electronic resource

Relation: http://www.sciencedirect.com/science/article/pii/S2238785422020877; https://doaj.org/toc/2238-7854

URL الوصول: https://doaj.org/article/3c431bc4b2ed4a0c9a8ca183330daca4

المؤلفون: Siva Sankar, L. V., Ebenezer, K., Thoufiq Mohammed, K.^{Aff1, IDs1075102401985z_cor3}, Manisekar, K.

المصدر: Interactions. 245(1)

المؤلفون: Long, Xu, Yao, Yao, Wu, Yanpei, Xia, Weijuan, Ren, Lianfeng

المصدر: 2017 18th International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2017 18th International Conference on. :63-68 Aug, 2017

Relation: 2017 18th International Conference on Electronic Packaging Technology (ICEPT)

المؤلفون: Giriraju, Resmi^{Aff1, IDs4003002200656y_cor1}, Sengupta, Amlan Kumar, Pillai, Radhakrishna G.

المصدر: Journal of The Institution of Engineers (India): Series A: Civil, Architectural, Environmental and Agricultural Engineering. 103(3):867-879