يعرض 1 - 10 نتائج من 347 نتيجة بحث عن '"thermo-compression"', وقت الاستعلام: 0.86s تنقيح النتائج
  1. 1
    مؤتمر
    Reliable Chiplet Integration on High Density Laminate (2.XD) for AI Hardware

    المؤلفون: Taneja, Divya, Grenier, Jonathan, Ross, Joseph, Mori, Horiyuki, Raghvan, Sathya, Quinlan, Brian, De Sousa, Isabel, Wassick, Thomas, Bonilla, Griselda

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :581-586 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  2. 2
    مؤتمر
    High Density Integration of Silicon Photonic Chiplets for 51.2T Co-packaged Optics

    المؤلفون: Kannan, Sukeshwar, Chang, Ray, Potluri, Hari, Zhang, Sheng, Li, Jay, Xu, Bruce, Hsu, Hsi-Chang

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :81-84 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  3. 3
    مؤتمر
    Low-Temperature Cu-Cu Bonding Using -oriented and Nanocrystalline Hybrid Surface Grains

    المؤلفون: Li, Chen-Ning, Ong, Jia-Juen, Chiu, Wei-Lan, Yang, Shih-Chi, Chang, Hsiang-Hung, Chen, Chih

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1312-1316 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  4. 4
    مؤتمر
    Cu/SnAg Pillar Bump Joints on Ni-Less Surface Finish in Laser Assisted Bonding (LAB)

    المؤلفون: Han, Sang Eun, Han, Seonghui, Lee, Tae-Young, Lee, Hoo-Jeong, Yoo, Sehoon

    المصدر: 2024 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2024 International Conference on. :85-86 Apr, 2024

    Relation: 2024 International Conference on Electronics Packaging (ICEP)

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  5. 5
    مؤتمر
    Low-Temperature Cu-Cu Bonding using Nanocrystalline Grains

    المؤلفون: Li, Chen-Ning, Chiu, Wei-Lan, Chang, Hsiang-Hung, Chen, Chih

    المصدر: 2024 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2024 International Conference on. :109-110 Apr, 2024

    Relation: 2024 International Conference on Electronics Packaging (ICEP)

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  6. 6
    مؤتمر
    Plasma Cleaning and Thermal Compression Bonding of Indium Bumps as Superconducting Interconnects for Cryogenic and Quantum Computing Applications

    المؤلفون: Kang, Kumin, Derakhshandeh, Jaber, Wendeln, Christian, Schmidt, Ralf, Hao-Yu, Shafahian, Ehsan, El-Mekki, Zaid, Cochet, Tom, Maehara, Masataka, Beyne, Eric

    المصدر: 2024 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2024 International Conference on. :267-268 Apr, 2024

    Relation: 2024 International Conference on Electronics Packaging (ICEP)

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  7. 7
    مؤتمر
    On the path to AI hardware via chiplet integration enabled by high density organic substrates

    المؤلفون: Bonilla, Griselda, Quinlan, Brian, Wassick, Thomas, Kastberg, Russell, Li, Shidong, Basutkar, Monali

    المصدر: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :1374-1380 May, 2023

    Relation: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)

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  8. 8
    مؤتمر
    CMOS-Compatible Fine Pitch Al-Al Bonding

    المؤلفون: Cheemalamarri, Hemanth Kumar, Varghese, Binni, Jaibir, Sharma, Hongyu, Li, S, Chandra Rao S, Singh, Navab, Rao, Vempati Srinivasa, Chui, King-Jien

    المصدر: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :1725-1729 May, 2023

    Relation: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)

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  9. 9
    مؤتمر
    Direct Bonded Heterogeneous Integration (DBHi): Surface Bridge Approach for Die Tiling

    المؤلفون: Pulido, Claudia Cristina Barrera, Kohara, Sayuri, Jain, Aakrati, Wassick, Thomas, Taneja, Divya, McInnes, Philip, Horibe, Akihiro, De Sousa, Isabel

    المصدر: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :1053-1059 May, 2023

    Relation: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)

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  10. 10
    مؤتمر
    Heterogeneous Integration on Organic Interposer Substrate with fine-pitch RDL and 40 micron pitch Micro-bumps

    المؤلفون: Sakuma, Katsuyuki, Bonilla, Griselda, McHerron, Dale, Aoki, Toyohiro, Kastberg, Russell, Pomerantz, Glenn, Bunt, Jay, Wassick, Tom

    المصدر: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :872-877 May, 2023

    Relation: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)

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