المؤلفون: Persano, A., Bagolini, A., Iannacci, J., Novel, D., Campa, A., Quaranta, F.

المصدر: IEEE Sensors Journal IEEE Sensors J. Sensors Journal, IEEE. 23(15):16710-16720 Aug, 2023

المؤلفون: Huang, Sixin, Long, Haohui, Li, Jianhui, Fang, Jianping, Gao, Jiaying

المصدر: 2022 IEEE International Flexible Electronics Technology Conference (IFETC) Flexible Electronics Technology Conference (IFETC), 2022 IEEE International. :1-6 Aug, 2022

Relation: 2022 IEEE International Flexible Electronics Technology Conference (IFETC)

المؤلفون: Goritz, A., Wipf, S.T., Drost, M., Lisker, M., Wipf, C., Wietstruck, M., Kaynak, M.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 12(6):921-932 Jun, 2022

المؤلفون: Xinrui Chen, Xing Han, Caixia Zhang, Xue Ou, Xiaoli Liu, Junhua Zhang, Wei Liu, Arthur J. Ragauskas, Xueping Song, Zhanying Zhang

المصدر: Small Structures, Vol 5, Iss 7, Pp n/a-n/a (2024)

مصطلحات موضوعية: carbon quantum dots, cellulose nanofibrils, light‐emitting diodes, thin‐film encapsulation, UV curable acrylic resins, Physics, QC1-999, Chemistry, QD1-999

وصف الملف: electronic resource

Relation: https://doaj.org/toc/2688-4062

URL الوصول: https://doaj.org/article/11e7a91534af4430bd03cba02c9ba36d

المؤلفون: Sang, Mingyu, Yu, Ki Jun

المصدر: 2019 Electron Devices Technology and Manufacturing Conference (EDTM) Electron Devices Technology and Manufacturing Conference (EDTM), 2019. :16-19 Mar, 2019

Relation: 2019 Electron Devices Technology and Manufacturing Conference (EDTM)

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المؤلفون: Calayir, Enes, Merugu, Srinivas, Xu, Jinglin, Singh, Navab, Pileggi, Larry, Piazza, Gianluca, Fedder, Gary K.

المصدر: 2017 IEEE International Ultrasonics Symposium (IUS) Ultrasonics Symposium (IUS), 2017 IEEE International. :1-4 Sep, 2017

Relation: 2017 IEEE International Ultrasonics Symposium (IUS)

المؤلفون: Yong Cheon Park, Kihoon Jeong, Dahye Ahn, Youson Kim, Sung Gap Im

المصدر: Organic Materials, Vol 5, Iss 01, Pp 66-71 (2023)

مصطلحات موضوعية: initiated chemical vapor deposition (icvd), thin film encapsulation (tfe), low-t g adhesive, Chemistry, QD1-999

وصف الملف: electronic resource

Relation: https://doaj.org/toc/2625-1825

URL الوصول: https://doaj.org/article/ae91803578304fa8805efa1ab485bd5a

المؤلفون: Buyue Zhang, Zhenyu Wang, Jintao Wang, Xinyu Chen

المصدر: Micromachines, Vol 15, Iss 4, p 478 (2024)

مصطلحات موضوعية: atomic layer deposition, functional integration, steric hindrance, thin-film encapsulation, flexible organic light-emitting diodes, Mechanical engineering and machinery, TJ1-1570

وصف الملف: electronic resource

Relation: https://www.mdpi.com/2072-666X/15/4/478; https://doaj.org/toc/2072-666X

URL الوصول: https://doaj.org/article/1a875b6252104dbd92bcff076d60b293

المؤلفون: Koden, Mitsuhiro^Aff2

المساهمون: Koden, Mitsuhiro^Aff1

المصدر: Flexible OLEDs : Fundamental and Novel Practical Technologies. :71-79