يعرض 1 - 10 نتائج من 60 نتيجة بحث عن '"thin film metal"', وقت الاستعلام: 1.15s تنقيح النتائج
  1. 1
    دورية أكاديمية
    Measurements of the Thermophysical Characteristics of Thin-Film Metal Filters for Extreme-Ultraviolet Radiation

    المؤلفون: Lopatin, A. Ya.Aff1, IDS1027451023060344_cor1, Luchin, V. I., Salashchenko, N. N., Tsybin, N. N., Chkhalo, N. I.

    المصدر: Journal of Surface Investigation: X-ray, Synchrotron and Neutron Techniques. 17(6):1323-1331

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  2. 2
    دورية أكاديمية
    Impact of Physical Deformation on Electrical Performance of Paper-Based Sensors

    المؤلفون: Nassar, J.M., Hussain, M.M.

    المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 64(5):2022-2029 May, 2017

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  3. 3
    دورية أكاديمية
    Polymer-based cantilevers with integrated electrodes

    المؤلفون: Mouaziz, S., Boero, G., Popovic, R.S., Brugger, J.

    المصدر: Journal of Microelectromechanical Systems J. Microelectromech. Syst. Microelectromechanical Systems, Journal of. 15(4):890-895 Aug, 2006

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  4. 4
    مؤتمر
    Design and Fabrication of a Micro Coulter Counter with Thin Film Electrodes

    المؤلفون: Zheng, Siyang, Tai, Yu-Chong

    المصدر: 2006 International Conference on Microtechnologies in Medicine and Biology Microtechnologies in Medicine and Biology, 2006 International Conference on. :16-19 May, 2006

    Relation: 2006 International Conference on Microtechnologies in Medicine and Biology

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  5. 5
    دورية أكاديمية
    Effects of the Thin-Film Metal Ground Embedded in On-Chip Microstrip Lines

    المؤلفون: Zhang, L., Song, J.

    المصدر: IEEE Microwave and Wireless Components Letters IEEE Microw. Wireless Compon. Lett. Microwave and Wireless Components Letters, IEEE. 17(6):439-441 Jun, 2007

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  6. 6
    دورية أكاديمية
    Characterization and Analysis of Metal Adhesion to Parylene Polymer Substrate Using Scotch Tape Test for Peripheral Neural Probe

    المؤلفون: Seonho Seok, HyungDal Park, Jinseok Kim

    المصدر: Micromachines, Vol 11, Iss 6, p 605 (2020)

    مصطلحات موضوعية: adhesion, thin film metal, parylene, neural probe, scotch tape test, FEM, Mechanical engineering and machinery, TJ1-1570

    وصف الملف: electronic resource

    Relation: https://www.mdpi.com/2072-666X/11/6/605; https://doaj.org/toc/2072-666X

    URL الوصول: https://doaj.org/article/a025dc1f652e405899bc1849eab6b645

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  7. 7
    كتاب إلكتروني
    Geometric Diodes for Optical Rectennas

    المؤلفون: Zhu, ZixuAff3, Joshi, SaumilAff3, Grover, SachitAff4, Moddel, GarretAff3

    المساهمون: Moddel, Garret, editorAff1, Grover, Sachit, editorAff2

    المصدر: Rectenna Solar Cells. :209-227

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  8. 8
    Preparation of Zr-Al-Mo-Cu Single Targets with Glass Forming Ability and Deposition of Thin Film Metallic Glass

    المؤلفون: Se-Hun Kwon, Seung Yong Shin, Kyoung Il Moon, Yoon Hae Won, Lee Han Chan

    المصدر: Coatings, Vol 10, Iss 398, p 398 (2020)
    Coatings
    Volume 10
    Issue 4

    مصطلحات موضوعية: Materials science, Amorphous metal, thin-film metal glass, Surfaces and Interfaces, compositional uniformity, coatings, engineering.material, Casting, Surfaces, Coatings and Films, Amorphous solid, Microcrystalline, crystalline target, Chemical engineering, Coating, Sputtering, lcsh:TA1-2040, Materials Chemistry, engineering, Deposition (phase transition), Thin film, lcsh:Engineering (General). Civil engineering (General), glass-forming ability

    وصف الملف: application/pdf

    URL الوصول: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::c9b6a7d1d5dcd59925fcbd1cf5e4d789
    https://www.mdpi.com/2079-6412/10/4/398

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  9. 9
    Reliability analysis of foil substrate based integration of silicon chips

    المؤلفون: Palavesam, Nagarajan

    المساهمون: Bock, Karlheinz, Svasta, Paul, Technische Universität Dresden

    مصطلحات موضوعية: Flexible Electronics, Flexible Silicon, Electronic packaging, Fatigue reliability, Thin film metal, ddc:621.3

    URL الوصول: https://explore.openaire.eu/search/publication?articleId=od______4179::785d509c05b1e7c38de60ab93cca9569
    https://tud.qucosa.de/id/qucosa:73098

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  10. 10
    Memory Solutions for Flexible Thin-Film Logic: Up to 8kb, >105.9kb/s LPROM and SRAM with Integrated Timing Generation Meeting the ISO NFC Standard

    المؤلفون: De Roose, Florian, Genoe, Jan, Kronemeijer, Auke J, Myny, Kris, Dehaene, Wim

    المساهمون: Fujino, LC, Anderson, JH, Belostotski, L, Dunwell, D, Gaudet, V, Gulak, G, Haslett, JW, Halupka, D, Smith, KC

    المصدر: Digest of Technical Papers-IEEE International Solid-State Circuits Conference, 2019 IEEE International Solid-State Circuits Conference, ISSCC 2019, 17 February 2019 through 21 February 2019, 206-208

    مصطلحات موضوعية: Technology, Low-power memory, Thin films, Budget control, Storage capacity, Hardware_PERFORMANCEANDRELIABILITY, Static random access storage, Engineering, Metallic compounds, Flexible thin films, Timing circuits, Hardware_INTEGRATEDCIRCUITS, Flexible circuit, Data storage, ISO Standards, Thin film metal, Science & Technology, Thin film transistors, Engineering, Electrical & Electronic, Computer circuits, Data handling, Thin film circuits, Flexible displays, Metals, Improving performance, Large scale productions, Memory architecture, Hardware_LOGICDESIGN

    URL الوصول: https://explore.openaire.eu/search/publication?articleId=dedup_wf_001::21958057782920e0ea9b935e40e04699
    http://resolver.tudelft.nl/uuid:809159b0-ef63-4371-be3d-3fb6d0b10e2e

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