المؤلفون: Li, Haoyu, Wang, Dong, Zhou, Jiazheng, Liu, Junhua, Liao, Huailin

المصدر: 2024 IEEE International Symposium on Circuits and Systems (ISCAS) Circuits and Systems (ISCAS), 2024 IEEE International Symposium on. :1-5 May, 2024

Relation: 2024 IEEE International Symposium on Circuits and Systems (ISCAS)

المؤلفون: Tominov, Roman, Vakulov, Zakhar, Kazantsev, Victor, Prakash, Chander, Ugryumov, Ivan, Smirnov, Vladimir

المصدر: 2023 7th Scientific School Dynamics of Complex Networks and their Applications (DCNA) Scientific School Dynamics of Complex Networks and their Applications (DCNA), 2023 7th. :273-276 Sep, 2023

Relation: 2023 7th Scientific School Dynamics of Complex Networks and their Applications (DCNA)

المؤلفون: Dobre, Mihaela-Daniela, Coll, Philippe, Brezeanu, Gheorghe

المصدر: 2022 International Semiconductor Conference (CAS) Semiconductor Conference (CAS), 2022 International. :131-134 Oct, 2022

Relation: 2022 International Semiconductor Conference (CAS)

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المؤلفون: M, Monishmurali, Kranthi, Nagothu Karmel, Boselli, Gianluca, Shrivastava, Mayank

المصدر: 2023 IEEE International Reliability Physics Symposium (IRPS) Reliability Physics Symposium (IRPS), 2023 IEEE International. :1-5 Mar, 2023

Relation: 2023 IEEE International Reliability Physics Symposium (IRPS)

المؤلفون: Bordun, O.M., Bordun, B.O., Kofliuk, I.M., Kukharskyy, I.Yo., Medvid, I.I., Protsak, M.V.

المصدر: 2021 IEEE 12th International Conference on Electronics and Information Technologies (ELIT) Electronics and Information Technologies (ELIT), 2021 IEEE 12th International Conference on. :33-36 May, 2021

Relation: 2021 IEEE 12th International Conference on Electronics and Information Technologies (ELIT)

المؤلفون: Siebenhofer, Matthäus^{Aff1, Aff2, IDs41467024458249_cor1}, Nenning, Andreas, Rameshan, Christoph, Blaha, Peter, Fleig, Jürgen, Kubicek, Markus^{Aff1, IDs41467024458249_cor6}

المصدر: Nature Communications. 15(1)

المؤلفون: Huang, Sung-Wei, Hwu, Jenn-Gwo

المصدر: 2023 International VLSI Symposium on Technology, Systems and Applications (VLSI-TSA/VLSI-DAT) Technology, Systems and Applications (VLSI-TSA/VLSI-DAT), 2023 International VLSI Symposium on. :1-2 Apr, 2023

Relation: 2023 International VLSI Symposium on Technology, Systems and Applications (VLSI-TSA/VLSI-DAT)

المؤلفون: Yan Zhao, Lei Liu, Dengcui Yang, Weinan Li, Jianlin Yu, Zhengzhi Zhao

المصدر: Metals, Vol 14, Iss 7, p 760 (2024)

مصطلحات موضوعية: 38Cr3MnNbVMo hot-stamped steel, high-temperature oxidation resistance, extremely thin oxide layer, Fe2SiO4 and FeCr2O4 oxides, Mining engineering. Metallurgy, TN1-997

وصف الملف: electronic resource

Relation: https://www.mdpi.com/2075-4701/14/7/760; https://doaj.org/toc/2075-4701

URL الوصول: https://doaj.org/article/955f22301f1d4db48daf58703db31993

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