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1مؤتمر
المؤلفون: Li, Haoyu, Wang, Dong, Zhou, Jiazheng, Liu, Junhua, Liao, Huailin
المصدر: 2024 IEEE International Symposium on Circuits and Systems (ISCAS) Circuits and Systems (ISCAS), 2024 IEEE International Symposium on. :1-5 May, 2024
Relation: 2024 IEEE International Symposium on Circuits and Systems (ISCAS)
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2مؤتمر
المؤلفون: Gak, Joel, Marin, Jorge, Gonzalez, Nicolas, Arevalos, Daniel, Calarco, Nicolas, Miguez, Matias, Cortes, Alfonso, Osorio, Vicente, Romero, Mario, Rojas, Christian A.
المصدر: 2024 Argentine Conference on Electronics (CAE) Electronics (CAE), 2024 Argentine Conference on. :120-123 Mar, 2024
Relation: 2024 Argentine Conference on Electronics (CAE)
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3مؤتمر
المؤلفون: Tominov, Roman, Vakulov, Zakhar, Kazantsev, Victor, Prakash, Chander, Ugryumov, Ivan, Smirnov, Vladimir
المصدر: 2023 7th Scientific School Dynamics of Complex Networks and their Applications (DCNA) Scientific School Dynamics of Complex Networks and their Applications (DCNA), 2023 7th. :273-276 Sep, 2023
Relation: 2023 7th Scientific School Dynamics of Complex Networks and their Applications (DCNA)
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4مؤتمر
المؤلفون: Dobre, Mihaela-Daniela, Coll, Philippe, Brezeanu, Gheorghe
المصدر: 2022 International Semiconductor Conference (CAS) Semiconductor Conference (CAS), 2022 International. :131-134 Oct, 2022
Relation: 2022 International Semiconductor Conference (CAS)
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5مؤتمر
المؤلفون: Bordun, O.M., Bordun, B.O., Kofliuk, I.M., Kukharskyy, I.Yo., Medvid, I.I., Protsak, M.V.
المصدر: 2021 IEEE 12th International Conference on Electronics and Information Technologies (ELIT) Electronics and Information Technologies (ELIT), 2021 IEEE 12th International Conference on. :33-36 May, 2021
Relation: 2021 IEEE 12th International Conference on Electronics and Information Technologies (ELIT)
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6مؤتمر
المؤلفون: Heo, Hyunwoo, You, Donggeun, Kim, Hyungseup, Kwon, Yongsu, Ko, Hyoungho, Kim, Dong Kyue, Choi, Byong-Deok, Kim, Ji-Hoon
المصدر: 2021 International Conference on Electronics, Information, and Communication (ICEIC) Electronics, Information, and Communication (ICEIC), 2021 International Conference on. :1-4 Jan, 2021
Relation: 2021 International Conference on Electronics, Information, and Communication (ICEIC)
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7دورية أكاديمية
المؤلفون: Si, M., Murray, A., Lin, Z., Andler, J., Li, J., Noh, J., Alajlouni, S., Niu, C., Lyu, X., Zheng, D., Maize, K., Shakouri, A., Datta, S., Agrawal, R., Ye, P.D.
المصدر: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 68(7):3195-3199 Jul, 2021
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8مؤتمر
المؤلفون: Dunn, Clyde, MacPeak, John, Bo, Sean, Kirkpatrick, Brian, Horning, Brian, Grider, Tad, O'Brien, Corey, Heinrich-Barna, Steve, Vigil, Armando, Nafziger, Jon, Preiss, Lyndon, DeShields, Kelly, Markov, Viktor, Kim, JinHo, Do, Nhan, Kotov, Alexander
المصدر: 2020 IEEE International Reliability Physics Symposium (IRPS) Reliability Physics Symposium (IRPS), 2020 IEEE International. :1-5 Apr, 2020
Relation: 2020 IEEE International Reliability Physics Symposium (IRPS)
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9دورية أكاديمية
المصدر: IEEE Access Access, IEEE. 9:163929-163937 2021
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10دورية أكاديمية
المؤلفون: Yan Zhao, Lei Liu, Dengcui Yang, Weinan Li, Jianlin Yu, Zhengzhi Zhao
المصدر: Metals, Vol 14, Iss 7, p 760 (2024)
مصطلحات موضوعية: 38Cr3MnNbVMo hot-stamped steel, high-temperature oxidation resistance, extremely thin oxide layer, Fe2SiO4 and FeCr2O4 oxides, Mining engineering. Metallurgy, TN1-997
وصف الملف: electronic resource