يعرض 1 - 10 نتائج من 2,234 نتيجة بحث عن '"through-silicon via (TSV)"', وقت الاستعلام: 1.54s تنقيح النتائج
  1. 1
    مؤتمر
    Room-Temperature Hybrid Bonding of Via-middle TSV Wafer Fabricated by Direct Si/Cu Grinding and Residual Metal Removal

    المؤلفون: Watanabe, Naoya, Yamamoto, Hiroshi, Mitsui, Takahiko

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :2101-2106 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  2. 2
    مؤتمر
    Impact of Pitch Scaling on 3D Die-to-Die Interconnects

    المؤلفون: Pantano, Nicolas, Stucchi, Michele, Van der Plas, Geert, Beyne, Eric

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1064-1071 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  3. 3
    مؤتمر
    Electrical-Thermal Co-analysis of TSV Embedded Microfluidic Pin-fin Heatsink for High Power Dissipation with High Bandwidth Density

    المؤلفون: Chung, Euichul, Yan, Geyu, Ramakrishnan, Bharath, Alissa, Husam, Oruganti, Vaidehi, Belady, Christian, Masselink, Erik W., Bakir, Muhannad S.

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1479-1484 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  4. 4
    مؤتمر
    Crosstalk and Power Analysis in Tapered based Composite Cu-CNT TSV in 3D IC

    المؤلفون: Chandrakar, Shivangi, Gupta, Deepika, Majumder, Manoj Kumar

    المصدر: 2024 IEEE International Symposium on Circuits and Systems (ISCAS) Circuits and Systems (ISCAS), 2024 IEEE International Symposium on. :1-5 May, 2024

    Relation: 2024 IEEE International Symposium on Circuits and Systems (ISCAS)

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  5. 5
    دورية أكاديمية
    Optimization of 3-D IC Routing Based on Thermal Equalization Analysis

    المؤلفون: Liu, L., Wang, F., Yin, X., Sun, C., Li, X., Li, Y., Yu, N., Yang, Y.

    المصدر: IEEE Transactions on Device and Materials Reliability IEEE Trans. Device Mater. Relib. Device and Materials Reliability, IEEE Transactions on. 24(2):250-259 Jun, 2024

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  6. 6
    دورية أكاديمية
    Design and Fabrication of a TR Microsystem in Ka-Band With Si-Based 3-D Heterogeneous Integration

    المؤلفون: Yu, F., Guo, X., Ma, S., Wang, C., Feng, G., Wang, Z.

    المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 14(5):862-871 May, 2024

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  7. 7
    دورية أكاديمية
    Improving the Reliability of Through Silicon Vias: Reducing Copper Protrusion by Artificial Defect Manipulation and Annealing

    المؤلفون: Choi, W., Yoo, M.J., Bae, J., Seo, J., Lee, C.S.

    المصدر: IEEE Transactions on Semiconductor Manufacturing IEEE Trans. Semicond. Manufact. Semiconductor Manufacturing, IEEE Transactions on. 37(2):166-173 May, 2024

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  8. 8
    دورية أكاديمية
    Multiobjective Optimization for PSIJ Mitigation and Impedance Improvement Based on PCPS/DR-NSDE in Chiplet-Based 2.5-D Systems

    المؤلفون: Zhi, C., Dong, G., Xiong, W., Yang, D., Liu, D., Feng, Y., Wang, Y., Zhu, Z., Yang, Y.

    المصدر: IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst. Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on. 43(8):2235-2248 Aug, 2024

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  9. 9
    دورية أكاديمية
    Influence of Inhomogeneous Anisotropic Copper Grains in TSV on the Thermo-Mechanical Behaviors in the Annealing Process

    المؤلفون: Zhang, Y., Sheng, C., Wang, S., Liu, T., Gao, Z., Liu, S.

    المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 14(4):601-610 Apr, 2024

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  10. 10
    دورية أكاديمية
    A Self-Biased Current Reference Source-Based Pre-Bond TSV Test Solution

    المؤلفون: Liu, J., Cheng, S., Chen, T., Wu, X., Liang, H.

    المصدر: IEEE Transactions on Very Large Scale Integration (VLSI) Systems IEEE Trans. VLSI Syst. Very Large Scale Integration (VLSI) Systems, IEEE Transactions on. 32(4):774-781 Apr, 2024

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