المؤلفون: Matsuura, Yoshinori, Yoshida, Tatsuya, Komiya, Yukiko, Nakamura, Toshimi, Yanai, Takenori, Okuyama, Kazuhiro, Kuwahara, Kyohei, Kitabatake, Yukiko, Ishii, Rintaro, Hayashi, Katsuyuki, Kubota, Takashi, Fujii, Joji, Dutta, Vivek B.

المصدر: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2022 IEEE 24th. :513-516 Dec, 2022

Relation: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)

المؤلفون: Chiang, Tzu-Fan, Cheng, Wen-Nan, Lin, Meng-Bi, Cheng, Chih-Chun^{Aff1, IDs00170023129318_cor4}, Tsai, Chung-Yu

المصدر: The International Journal of Advanced Manufacturing Technology. 130(9-10):4415-4430

المؤلفون: Liu, Bin^Aff5

المساهمون: Wang, Yangyuan, editor^Aff1, Chi, Min-Hwa, editor^Aff2, Lou, Jesse Jen-Chung, editor^Aff3, Chen, Chun-Zhang, editor^Aff4

المصدر: Handbook of Integrated Circuit Industry. :1237-1284

المؤلفون: Saito, Takashi, Kitajima, Tokuyuki, Kawaguchi, Makoto, Tajima, Shinya, Okamoto, Masashi

المصدر: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :1957-1963 Jun, 2020

Relation: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC)

المؤلفون: Jourdain, Anne, De Vos, Joeri, Rassoul, Nouredine, Zahedmanesh, Houman, Miller, Andy, Beyer, Gerald, Beyne, Eric, Walsby, Edward, Patel, Jash, Ansell, Oliver, Ashraf, Huma, Thomas, Dave, Li, Shifang, Chang, Timothy, Hiebert, Stephen, Stoerring, Moritz, Cross, Andrew

المصدر: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2018 IEEE 68th. :1529-1536 May, 2018

Relation: 2018 IEEE 68th Electronic Components and Technology Conference (ECTC)

المؤلفون: Uhrmann, Thomas, Matthias, Thorsten, Wimplinger, Markus, Burggraf, Jurgen, Burgstaller, Daniel, Wiesbauer, Harald, Lindner, Paul

المصدر: 2013 IEEE International 3D Systems Integration Conference (3DIC) 3D Systems Integration Conference (3DIC), 2013 IEEE International. :1-8 Oct, 2013

Relation: 2013 IEEE International 3D Systems Integration Conference (3DIC)

المؤلفون: Yuanhang Liu, Hongfei Tao, Dewen Zhao, Xinchun Lu

المصدر: Materials, Vol 15, Iss 12, p 4230 (2022)

مصطلحات موضوعية: total thickness variation, backside grinding, grinding tool configuration, angle adjustment, ultra-precision grinding, Technology, Electrical engineering. Electronics. Nuclear engineering, TK1-9971, Engineering (General). Civil engineering (General), TA1-2040, Microscopy, QH201-278.5, Descriptive and experimental mechanics, QC120-168.85

وصف الملف: electronic resource

Relation: https://www.mdpi.com/1996-1944/15/12/4230; https://doaj.org/toc/1996-1944

URL الوصول: https://doaj.org/article/ecc13acd16df4d199dc7f012d6c9e6f6

المؤلفون: Sharma Mithun, Sahni Sanjeev P., Sharma Shilpi

المصدر: Engineering Management in Production and Services, Vol 11, Iss 2, Pp 87-105 (2019)

مصطلحات موضوعية: six sigma, quality, silicon wafer, lapping, quality control, total thickness variation, wafer manufacturing, Production management. Operations management, TS155-194

وصف الملف: electronic resource

Relation: https://doaj.org/toc/2543-912X

URL الوصول: https://doaj.org/article/232982753a9d4891bdd6db72017dee44

المؤلفون: Marks, M.R., Hassan, Z., Cheong, K.Y.

المصدر: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 4(12):2042-2057 Dec, 2014

المؤلفون: Arash Khakzadshahandashti, Mohsen Pirmohammadi

المصدر: انرژی‌های تجدیدپذیر و نو, Vol 8, Iss 2, Pp 86-90 (2021)

مصطلحات موضوعية: implant and cleave, Hardware_INTEGRATEDCIRCUITS, low thickness silicon wafers, TJ807-830, ComputerApplications_COMPUTERSINOTHERSYSTEMS, Hardware_PERFORMANCEANDRELIABILITY, stress liftoff, total thickness variation, Renewable energy sources

URL الوصول: https://explore.openaire.eu/search/publication?articleId=doajarticles::baa4e3c7206c8219a7a99178374c611c
http://www.jrenew.ir/article_122262_bb75828ced60270e2e17ea7bc9f28907.pdf