يعرض 1 - 10 نتائج من 6,756 نتيجة بحث عن '"tsv"', وقت الاستعلام: 0.85s تنقيح النتائج
  1. 1
    دورية أكاديمية
    Voltage Skew-Based Test Technique for Pre-Bond TSVs in 3-D ICs

    المؤلفون: Liu, J., Chen, Z., Chen, T., Wu, X., Liang, H., Yuan, X.

    المصدر: IEEE Transactions on Circuits and Systems II: Express Briefs IEEE Trans. Circuits Syst. II Circuits and Systems II: Express Briefs, IEEE Transactions on. 71(8):3930-3934 Aug, 2024

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  2. 2
    دورية أكاديمية
    Multiobjective Optimization for PSIJ Mitigation and Impedance Improvement Based on PCPS/DR-NSDE in Chiplet-Based 2.5-D Systems

    المؤلفون: Zhi, C., Dong, G., Xiong, W., Yang, D., Liu, D., Feng, Y., Wang, Y., Zhu, Z., Yang, Y.

    المصدر: IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst. Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on. 43(8):2235-2248 Aug, 2024

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  3. 3
    دورية أكاديمية
    Optimization of 3-D IC Routing Based on Thermal Equalization Analysis

    المؤلفون: Liu, L., Wang, F., Yin, X., Sun, C., Li, X., Li, Y., Yu, N., Yang, Y.

    المصدر: IEEE Transactions on Device and Materials Reliability IEEE Trans. Device Mater. Relib. Device and Materials Reliability, IEEE Transactions on. 24(2):250-259 Jun, 2024

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  4. 4
    مؤتمر
    Si Interposer With Cu TSVs on Cu Substrate Thermally and Electrically Anchoring Qubit Chips in Millikelvin Assembly

    المؤلفون: Taguchi, Misato, Okidono, Takaaki, Miki, Takuji, Nagata, Makoto

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :447-450 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  5. 5
    مؤتمر
    High Performance 3D Package Technology for Mobile Application Processor (AP)

    المؤلفون: Kim, Sun Jae, Kim, Cheol, Jang, Huiyeong, Hong, Jongpa, Kim, Seongyo, Choi, Yongwon, Jo, Chajea, Seo, Sun-Kyung, Kim, Dong Kwan, Kim, Dae-Woo

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :348-352 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  6. 6
    مؤتمر
    Room-Temperature Hybrid Bonding of Via-middle TSV Wafer Fabricated by Direct Si/Cu Grinding and Residual Metal Removal

    المؤلفون: Watanabe, Naoya, Yamamoto, Hiroshi, Mitsui, Takahiko

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :2101-2106 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  7. 7
    مؤتمر
    Impact of Pitch Scaling on 3D Die-to-Die Interconnects

    المؤلفون: Pantano, Nicolas, Stucchi, Michele, Van der Plas, Geert, Beyne, Eric

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1064-1071 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  8. 8
    مؤتمر
    A novel plasma etching technology of RIE-lag free TSV and dicing processes for 3D chiplets interconnect

    المؤلفون: Suzuki, Taichi, Doi, Kenta, Nakamura, Toshiyuki, Morikawa, Yasuhiro

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1934-1939 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  9. 9
    مؤتمر
    New power delivery network(PDN) approach for extremely large FC-BGA with organic substrate based on over 1mm-thick core

    المؤلفون: Hwang, Kyojin, Jung, Woobin, Kim, Junghwa, Lee, Heeseok, Pak, Junso, Hwang, Jisoo

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :533-538 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  10. 10
    مؤتمر
    Electrical-Thermal Co-analysis of TSV Embedded Microfluidic Pin-fin Heatsink for High Power Dissipation with High Bandwidth Density

    المؤلفون: Chung, Euichul, Yan, Geyu, Ramakrishnan, Bharath, Alissa, Husam, Oruganti, Vaidehi, Belady, Christian, Masselink, Erik W., Bakir, Muhannad S.

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1479-1484 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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