يعرض 1 - 10 نتائج من 1,841 نتيجة بحث عن '"vertical profile"', وقت الاستعلام: 1.19s تنقيح النتائج
  1. 1
    مؤتمر
    SoC Profile Control for BEOL Tri-Layer Patterning Scheme

    المؤلفون: Xu, Xingxing., Zhou, Hexin, Li, Quanbao., Liu, Ya-Ming., Huang, Jian.

    المصدر: 2024 Conference of Science and Technology for Integrated Circuits (CSTIC) Science and Technology for Integrated Circuits (CSTIC), 2024 Conference of. :1-3 Mar, 2024

    Relation: 2024 Conference of Science and Technology for Integrated Circuits (CSTIC)

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  2. 2
    دورية أكاديمية
    A Multiple-Scattering Microwave Radiative Transfer Model for Land Emission With Vertically Heterogeneous Vegetation Coverage

    المؤلفون: Chen, K., Tan, S.

    المصدر: IEEE Transactions on Geoscience and Remote Sensing IEEE Trans. Geosci. Remote Sensing Geoscience and Remote Sensing, IEEE Transactions on. 62:1-14 2024

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  3. 3
    دورية أكاديمية
    Vertical Distribution of Saltating Particles in a Windsand Flux

    المؤلفون: Gushchin, R. A.Aff1, IDS1024856024700465_cor1, Gorchakov, G. I., Karpov, A. V., Datsenko, O. I.

    المصدر: Atmospheric and Oceanic Optics. 37(3):315-319

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  4. 4
    دورية أكاديمية
    TP-PROFILE: Monitoring the Thermodynamic Structure of the Troposphere over the Third Pole

    المؤلفون: Chen, XuelongAff1, Aff2, Aff3, Aff4, Liu, YajingAff1, IDs003760233199y_cor2, Ma, YaomingAff1, Aff2, Aff3, Aff4, Aff5, Aff6, IDs003760233199y_cor3, Ma, WeiqiangAff1, Aff2, Aff3, Aff4, Xu, Xiangde, Cheng, Xinghong, Li, Luhan, Xu, Xin, Wang, Binbin

    المصدر: Advances in Atmospheric Sciences. 41(6):1264-1277

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  5. 5
    دورية أكاديمية
    Surface Treatment of Fiberboard Wood Pulp Mat with Dispersed Water (by the Example of Arian Sina MDF Company)

    المؤلفون: Vahid Moazami, Abbas Yari Esbouei, Hamid Hatefnia

    المصدر: Лесной журнал, Iss 4, Pp 177-184 (2024)

    مصطلحات موضوعية: mat water spraying, medium density fiberboard, vertical profile density, sanding machine, Forestry, SD1-669.5

    وصف الملف: electronic resource

    Relation: https://journals.narfu.ru/index.php/fj/article/view/1925; https://doaj.org/toc/0536-1036

    URL الوصول: https://doaj.org/article/a4c8ee34ddb64c61b25af6c2641c1c25

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  6. 6
    دورية أكاديمية
    A Real-Time Bright Band Vertical Profile of Reflectivity Correction Using Multitilts of Reflectivity Data

    المؤلفون: Zhu, Z., Qi, Y.

    المصدر: IEEE Transactions on Geoscience and Remote Sensing IEEE Trans. Geosci. Remote Sensing Geoscience and Remote Sensing, IEEE Transactions on. 61:1-12 2023

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  7. 7
    كتاب إلكتروني
    Research on Flight Test Technologies of FMS Vertical Profile for Civil Aircraft

    المؤلفون: Li, XinAff11

    المساهمون: Ceccarelli, Marco, Series EditorAff1, Corves, Burkhard, Advisory EditorAff2, Glazunov, Victor, Advisory EditorAff3, Hernández, Alfonso, Advisory EditorAff4, Huang, Tian, Advisory EditorAff5, Jauregui Correa, Juan Carlos, Advisory EditorAff6, Takeda, Yukio, Advisory EditorAff7, Agrawal, Sunil K., Advisory EditorAff8, Carbone, Giuseppe, editorAff9, Laribi, Med Amine, editorAff10

    المصدر: Advances in Automation, Mechanical and Design Engineering : SAMDE 2023. 161:332-338

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  8. 8
    دورية أكاديمية
    Assessment of WRF-CO2 simulated vertical profiles of CO2 over Delhi region using aircraft and global model data

    المؤلفون: Ballav, SrabantiAff1, Aff2, IDs44273024000303_cor1, Patra, Prabir K.Aff3, Aff4, Naja, Manish, Mukherjee, Sandipan, Machida, Toshinobu

    المصدر: Asian Journal of Atmospheric Environment. 18(1)

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  9. 9
    مؤتمر
    Retrieval and Validation of Vertical Forest Lai Profile from Airborne Lidar Data

    المؤلفون: Wang, Yao, Fang, Hongliang, Zhang, Yinghui, Li, Sijia

    المصدر: 2021 IEEE International Geoscience and Remote Sensing Symposium IGARSS Geoscience and Remote Sensing Symposium IGARSS , 2021 IEEE International. :6712-6715 Jul, 2021

    Relation: IGARSS 2021 - 2021 IEEE International Geoscience and Remote Sensing Symposium

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  10. 10
    مؤتمر
    New innovative etch technologies utilizing state-of-the-art atomic-level process for advanced patterning

    المؤلفون: Kumakura, Sho, Katsunuma, Takayuki, Nishizuka, Tetsuya, Kihara, Yoshihide, Honda, Masanobu

    المصدر: 2022 6th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) Electron Devices Technology & Manufacturing Conference (EDTM), 2022 6th IEEE. :339-341 Mar, 2022

    Relation: 2022 6th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)

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