يعرض 1 - 10 نتائج من 54,272 نتيجة بحث عن '"via."', وقت الاستعلام: 1.03s تنقيح النتائج
  1. 1
    مؤتمر
    Room-Temperature Hybrid Bonding of Via-middle TSV Wafer Fabricated by Direct Si/Cu Grinding and Residual Metal Removal

    المؤلفون: Watanabe, Naoya, Yamamoto, Hiroshi, Mitsui, Takahiko

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :2101-2106 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  2. 2
    مؤتمر
    Reliability Assessment of Stacked-Vias with Different Configurations through a Unit Cell-based Substrate Design

    المؤلفون: Tunga, Krishna, Ross, Joseph, Iruvanti, Sushumna, Parikh, Bakul, Li, Shidong

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :118-125 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  3. 3
    مؤتمر
    High Aspect Ratio (AR) Through Glass Via (TGV) Etch Performance on Glass Core Substrates for High Density 3D Advanced Packaging Applications

    المؤلفون: Kim, Sung Jin, Govindarajulu, Venugopal, Tao, Coby, Brar, Aneelman, Karim, Zia

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :551-555 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  4. 4
    مؤتمر
    High-Performance Thermal and Electrical Characteristics of Via-Last (BBCube) Process in Multi-Layer 3D Integration

    المؤلفون: Chujo, Norio, Ryoson, Hiroyuki, Sakui, Koji, Sugatani, Shinji, Taguchi, Masao, Ohba, Takayuki

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1564-1568 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  5. 5
    مؤتمر
    Impact of Pitch Scaling on 3D Die-to-Die Interconnects

    المؤلفون: Pantano, Nicolas, Stucchi, Michele, Van der Plas, Geert, Beyne, Eric

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1064-1071 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  6. 6
    مؤتمر
    A Multi-Channel, Embedded, and Geometrically Optimized Filter Bank Utilizing Advanced Packaging Topologies for Miniaturized RF Modules in IoT and Wearable Systems

    المؤلفون: Al Jamal, Hani, Joshi, Marvin, Tentzeris, Manos M., Kingsley, Nickolas

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :208-214 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  7. 7
    مؤتمر
    Adhesion Layer Influence on Thermomechanical Reliability of Electroplated Copper Through-Glass Via (TGV)

    المؤلفون: Yang, Junbo, Pan, Ke, Yin, Pengcheng, Lai, Yangyang, Park, Seungbae, Okoro, Chukwudi, Joshi, Dhananjay, Pollard, Scott

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1820-1825 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  8. 8
    مؤتمر
    A surface-mount photonic package with a photonic-wire-bonded glass interposer as a hybrid integration platform for co-packaged optics

    المؤلفون: Uemura, Hiroshi, Misawa, Taichi, Mizuno, Yasutaka, Itabashi, Naoki, Arao, Hajime, Nakanishi, Tetsuya, Tanaka, Keiji, Sano, Tomomi, Uesaka, Katsumi, Miyairi, Mami, Ishizuki, Yoshikatsu, Sakai, Taiji, Kurita, Yoichiro

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :90-95 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  9. 9
    مؤتمر
    Laser micro drilling of around 3 microns into Ajinomoto Build-up Film

    المؤلفون: Otsu, Toshio, Tani, Shuntaro, Nagayama, Shoko, Miyamoto, Ryo, Okada, George, Nakamura, Naoyuki, Nishimae, Junichi, Tamaru, Hroharu, Kobayashi, Yohei

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :829-833 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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  10. 10
    مؤتمر
    Electrical-Thermal Co-analysis of TSV Embedded Microfluidic Pin-fin Heatsink for High Power Dissipation with High Bandwidth Density

    المؤلفون: Chung, Euichul, Yan, Geyu, Ramakrishnan, Bharath, Alissa, Husam, Oruganti, Vaidehi, Belady, Christian, Masselink, Erik W., Bakir, Muhannad S.

    المصدر: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2024 IEEE 74th. :1479-1484 May, 2024

    Relation: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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